Jun 26, 2001 The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.
The Mega™ II wash and rinse cycles incorporate a highly effective spray under immersion process, with strategically located venturi nozzles for maximum cleaning efficiency. The agitation can be controlled to handle sensitive wire bonded substrates or hard to clean, tight tolerance flip chip technology. An ultrasonics assist is available as an option for extremely tough cleaning requirements.
A new Pre-Wash feature for the Mega™ II allows it to operate in conjunction with AAT's patented closed-loop regenerative cleaning process, and allows for an optional dual chemistry cleaning process that dramatically increases throughput capabilities and decreases periodic maintenance requirements and operating costs. The Pre-Wash feature permits several chemistry choices, including DI water, organic solvents and alcohols, thus providing more diversified cleaning alternatives.
The Mega™ II is used for a multitude of applications including precision cleaning for pre-wire bonding applications and pre-conformal coating, as well as tight-tolerance cleaning under flip chip and post ball attachment cleaning of BGAs. The fully automated cleaner comes with precision process control, data logging and ultrasonic capabilities with applications in critical metal parts cleaning.
The Mega™ II Cleaner is an environmentally friendly, cost effective, closed loop cleaning system. This system allows users to obtain reliably clean electronic assemblies without creating an internal hazardous liquid waste stream. For more information, visit http://www.aat-corp.com or contact Austin American Technology Corporation, 12201-160 Technology Blvd., Austin, TX 78727-6102 USA, Tel. (512) 335-6400, Fax (512) 335-5753.
Founded in 1986, Austin American Technology (AAT) is an innovative, market-leading company, engineering and manufacturing production and assembly systems for the electronics manufacturing industry. With more than 400 years of collective experience in the electronics and semiconductor industries, AAT’s production solutions have included hot gas rework and solder paste testing systems, and AAT introduced the world's first automated stencil cleaner in 1988. During the 1990s, AAT developed batch cleaning systems and were early adopters of closed-loop (zero-discharge) capability. In 2000, AAT became a market leader in in-line cleaning systems with the introduction of the award-winning HYDROJET™ series, followed by the MICROJET™ inline flip chip cleaner to provide high volume cleaning capability in a small footprint. AAT systems are designed to maximize performance and minimize cost of ownership. For more information, visit www.aat-corp.com.
