Dec 14, 2009
S3X58-M650 is an ICT testable, halogen-free product that uses the SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
The other Koki paste is S3X70-M407, a lead-free no-clean solder paste for ultra-fine-pitch applications. Using a Type 5 powder, S3X70-M407 solder paste has been formulated for 0.2 mm pitch µBGA devices, as well as 0402 (01005) components. Features include excellent wetting in air environments and low voiding.
Koki has more than 45 years of experience in high-technology soldering applications, and is the leader in both no-clean and lead-free soldering applications. With global manufacturing, research and support, Koki continues to develop new technologies to meet and customers’ requests.
