Apr 08, 2009 
Military and aerospace electronics providers continue to push the technological envelope to design and manufacture leading edge electronics for today's users. Current design problems are not driven by circuit design capabilities but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required to meet the increasing size, weight, power and reliability requirements of this industry without sacrificing electrical, mechanical, or thermal performance.
Emerging technologies such as those imbedding components within organic substrates have proven capable of meeting and exceeding these design objectives. Imbedded Component/Die Technology (IC/DT�) addresses these design challenges by imbedding both active and passives into cavities within a multi-layer printed circuit board to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly.
This paper will discuss the design methodology, packaging processes, and test data gathered during the implementation of IC/DT� in a mixed signal prototype. The prototype designed and assembled using IC/DT� processes was subjected to reliability testing and ultimately demonstrated in a test flight. The results from this testing will be presented.
About STI Electronics Inc.
Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company develops and distributes other products for the soldering and electronics assembly as well as industrial markets. For more information, visit http://www.stielectronicsinc.com.
