Jul 01, 2013 
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Bernhard Lorenz, VP Engineering, will lead an expert discussion at the TechHub “Test” of SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. The presentation, entitled “Quality in 3D Production – Special Handling Requirements in Final Test,” will take place Wednesday, July 10 from 1 - 2 p.m. at the TechHub in the North Hall.
For a long time there was the understanding that for final test 3D has no implication – a package is a package. This has changed: high performance and functionality requirements combined with challenging packages and pitch sizes need to be addressed in a way that still supports best cost of test. Are there equipment solutions available that cover power dissipation and high parallel test of high I/O count packages that are more shock sensitive than standard SoCs?
Bernhard has presented several papers at 3D conferences focusing on new test requirements and test strategies. Very early he stressed that 3D quality assurance will go beyond the established KGD and final test approach. Bernhard’s team developed the first in-process test equipment for partial stack test during 3D assembly, which has been awarded with an industry prize for innovation.
Multitest (headquartered in Rosenheim, Germany) is one of the world’s leading manufacturers of test equipment for semiconductors. Multitest markets test handlers, contactors and ATE printed circuit boards. Multitest has more than 30 years of experience in the semiconductor industry, providing solutions to the automotive, consumer and communication but also to the sensor market. Globally, more than 900 employees serve the company’s customers in offices and branches in North America, Singapore, Malaysia, the Philippines, Taiwan, China and Thailand.
www.multitest.com
