Explore PEMTRON's Cutting-Edge Inspection Systems at the 2024 KPCA Show

PEMTRON today announced plans to exhibit at the upcoming KPCA Show, taking place Sept. 4-6, 2024 in Korea. Attendees will find PEMTRON at Booth J401, where the company will demonstrate its state-of-the-art POSEIDON and 8800AI inspection systems.

Introducing POSEIDON: PEMTRON’s advanced solution for wafer warpage measurement and FC-BGA bump inspection

For wafer warpage measurement, POSEIDON quickly and accurately measures warpage across the entire wafer surface. It analyzes flatness and coplanarity based on accurate 3D data and provides swift and precise profile and mapping data. For FC-BGA bump inspection, POSEIDON identifies fine defects with high-resolution imaging and conducts various inspections such as PCB warpage, bump height, bump coplanarity, bridging, large bump, and missing bump detection. It supports inspections of processes like wire bonding, bumped wafers, and Micro LED, and ensures accurate parameter measurement through 3D profiling.

Showcasing the 8800AI: an intelligent visual inspection system for FC-BGA and various PCBs

The 8800AI uses advanced algorithms and artificial intelligence to detect defects like foreign materials, stains, and scratches. It enhances FTY rates with PemBrain AI and supports full inspection of TOP & BOTTOM using an automated PCB logistics system.

Visitors to PEMTRON's booth will have the opportunity to experience live demonstrations of the POSEIDON and 8800AI systems in action. These demonstrations will showcase the systems' advanced features and capabilities, highlighting how they can revolutionize quality control and yield improvement in various manufacturing settings. PEMTRON's expert team will be on hand to provide detailed insights and answer any questions regarding these innovative solutions.

For more information about PEMTRON, please visit www.pemtron.com.

Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies

Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS),  FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).