Aug 12, 2024 
PEMTRON, an inspection equipment developer and supplier, today announced plans to exhibit at NEPCON Vietnam Hanoi 2024. The event is set to take place Sept. 11-13, 2024 at the I.C.E Hanoi (Cung Van Hoa), Vietnam. Be sure to visit PEMTRON at Booth G17, where their team will highlight the D2 (Dual Lane & Dual Head) Series, showcasing the latest advancements in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology.
The PEMTRON D2 System is at the forefront of inspection technology, setting a new benchmark with its innovative dual lanes and dual heads feature. This capability allows for the simultaneous inspection of two different PCBs, significantly enhancing productivity and throughput. The D2 System can handle various board configurations, including 8way + 4way, 12way + 4way, and 8way + 8way, demonstrating unparalleled efficiency and flexibility.
PEMTRON’s D2 includes a built-in library management system and an offline real-time debug station, ensuring ease of use and effective management. The system's customizable design allows adjustments based on various inspection objects.
Engineered for reliable performance, the D2 System is equipped with tele-centric lenses, high-speed CPUs, and advanced image processing capabilities, ensuring consistent and dependable operation. This innovative system is designed to meet the rigorous demands of modern manufacturing environments, making it an essential tool for enhancing quality and efficiency.
Discover how PEMTRON's advanced inspection solutions can transform your production processes, enhance flexibility, and improve overall manufacturing efficiency at NEPCON Vietnam 2024.
For more information about PEMTRON and its range of products, please visit www.pemtron.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
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