Sep 08, 2025 
PEMTRON, an inspection equipment developer and supplier, is pleased to announce its participation in SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Phoenix, Arizona. PEMTRON will be exhibiting in Booth 1635, where the company will highlight its most advanced inspection technologies: the 8800WI, APOLLON, MARS, and JUPITER.
Designed to meet the strict requirements of semiconductor packaging and advanced electronics production, PEMTRON’s systems deliver exceptional precision, speed, and reliability across a wide range of inspection applications.
8800WI – Next-Level Wafer Inspection
Equipped with advanced 2D and 3D imaging, the 8800WI excels in detecting defects across various bump structures, including micro bumps. Its precision imaging capabilities enable early-stage defect detection, enhancing reliability and yield in wafer-level manufacturing.
APOLLON – High-Performance Package Inspection
The APOLLON system inspects a diverse array of semiconductor packages such as BGA, LGA, QFN, QFP, CSP, and SOP. With real-time defect detection and automated reporting, it supports consistent quality standards while reducing production downtime.
MARS – High-Speed AVI for Memory Modules
The MARS Automated Visual Inspection system combines speed and accuracy to address the challenges of memory module manufacturing. Leveraging advanced image processing, MARS delivers reliable results in fast-paced production environments.
JUPITER – Advanced 3D X-ray Inspection
Ideal for in-depth analysis, JUPITER offers both 2D and 3D inspection powered by PCT reconstruction technology. Integrated with PEMTRON’s award-winning AOI algorithms and a high-resolution optical camera, JUPITER provides critical insights into process quality for applications like wire bond, solder joint, and internal structure inspection.
JUPITER also seamlessly connects with SPI and AOI systems, facilitating real-time data sharing and enabling manufacturers to respond to process deviations with greater speed and confidence.
Attendees are invited to visit Booth 1635 to explore the systems firsthand and speak with PEMTRON’s technical team about solutions tailored for semiconductor packaging, PCB assembly, and high-reliability manufacturing.
For more information about PEMTRON and its inspection systems, visit www.PEMTRON.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
