Sep 24, 2025 
PEMTRON is pleased to announce its participation at the TPCA Show, scheduled for October 22–24, 2025, at the Taipei Nangang Exhibition Center. Visitors can find PEMTRON at Booth K-1411, where the company will highlight two of its most advanced inspection solutions: the POSEIDON wafer warpage and bump inspection system and the 8800AI intelligent visual inspection platform.
POSEIDON: Precision Wafer Warpage and Bump Inspection
The POSEIDON system delivers highly accurate measurement of wafer warpage, flatness, and FC-BGA bump coplanarity—key parameters for processes such as wire bonding and Micro LED assembly. In addition, POSEIDON captures fine surface defects, including microcracks, missing bumps, and bridging. With rapid 3D data acquisition and real-time analysis, the system empowers manufacturers to maintain tight process control and minimize the risk of early-stage defects impacting downstream production.
8800AI: Intelligent Visual Inspection for FC-BGA and PCBs
The 8800AI is PEMTRON’s intelligent visual inspection solution designed for FC-BGA and a wide range of PCB applications. Leveraging advanced algorithms and artificial intelligence, the system detects defects such as foreign materials, stains, and scratches—improving First Time Yield (FTY) rates significantly. Powered by PemBrain AI, the 8800AI enables full inspection of both the top and bottom of PCBs via an integrated automated logistics system. Live demonstrations at the booth will showcase the 8800AI’s ability to elevate quality control and enhance production efficiency.
PEMTRON invites attendees to visit Booth K-1411 to experience firsthand how the POSEIDON and 8800AI are redefining standards in inspection technology.
To learn more or schedule a demo during the event, visit www.PEMTRON.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
