Oct 27, 2025 
PEMTRON, an inspection equipment developer and supplier, will showcase its latest inspection innovations designed to push the boundaries of speed, accuracy, and connectivity in electronics manufacturing. From November 18–21 at Messe München in Munich, visitors can get hands-on with PEMTRON’s newest solutions and see how they are reshaping inspection for high-reliability production environments.
PEMTRON’s productronica lineup will feature three flagship systems:
ATHENA TPI – Tall Part Inspection, Perfected
ATHENA TPI combines AI-driven algorithms with a precision projector to deliver fast, highly accurate measurements of challenging components such as press-fit connectors, housing pins, and shielding cases. Designed for manufacturers that demand absolute dimensional control, ATHENA TPI ensures consistent quality and confidence at every step.
TWIN – True Double-Sided 3D AOI
The TWIN system brings top-and-bottom inspection into a single pass, eliminating blind spots and boosting throughput. Its redesigned 3D imaging head delivers clearer, more stable results, giving manufacturers a complete picture of double-sided assemblies without slowing production.
JUPITER – Deep 3D X-ray Insight
JUPITER’s advanced PCT reconstruction technology, paired with PEMTRON’s award-winning AOI algorithms and high-resolution optical imaging, delivers unmatched visibility into solder joints, wire bonds, and internal structures. With seamless SPI and AOI integration, JUPITER turns inspection data into actionable process intelligence in real time.
Live demonstrations will be available throughout the show at Hall A2, Booth 412, giving attendees a firsthand look at how PEMTRON helps manufacturers make inspection faster, smarter, and more connected.
For more information about PEMTRON, please visit www.pemtron.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
