Oct 27, 2025 
PEMTRON, an inspection equipment developer and supplier, will exhibit its latest 3D SPI and AOI solutions at NEPCON Asia 2025, taking place October 28–30 at the Shenzhen World Exhibition & Convention Center (Baoan). The company will be in Booth 11E80 through its distributor AMT, featuring three of its most advanced systems — the SATURN 3D SPI, ATHENA 3D AOI, and EAGLE 3D 8800 Compact.
PEMTRON’s lineup at NEPCON Asia reflects its focus on precision inspection and process efficiency for high-reliability manufacturing across AI, automotive, and semiconductor sectors.
The SATURN 3D Inline SPI System delivers detailed 2D color imaging combined with accurate 3D measurement using Moiré technology. Designed for high-speed lines, it captures realistic solder paste images with quad projection and resolutions of 10/15 or 18μm, using a 4MP or optional 10MP camera. SATURN helps manufacturers maintain consistent solder volume and height control across even the most demanding production runs.
The ATHENA 3D AOI System integrates AI-driven inspection functions, including automatic judgment, auto-teaching, and OCR. Its 12-way projection system minimizes shadow interference and enables highly accurate 3D measurements. ATHENA supports both 2D and 3D simultaneous inspection with resolutions down to 10μm and offers an optional 12MP camera and three-stage conveyor to maximize throughput.
Also featured will be the EAGLE 3D 8800 Compact, a high-speed AOI system built for next-generation packaging and semiconductor applications. It offers precise inspection of coplanarity, leads, and solder joints for advanced components such as chiplets and CSPs, delivering stable results at production-level speeds.
Visitors can explore these systems in action at Booth 11E80, where PEMTRON and AMT representatives will be available for live demonstrations and technical discussions.
For more information about PEMTRON, please visit www.pemtron.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
