Oct 12, 2012 
This book is the second publication written by Bob Willis as a FREE download, his first on Pin In Hole Reflow has been read by over 3000 engineers worldwide and published with SMT magazine.
Package On Package Assembly Inspection & Quality Control will be launched in February 2013 with pre-registration for this publication available now at www.packageonpackagebook.com
In the meantime take a look at all of our PoP Training Products & Services at www.packageonpackage.co.uk
100+ pages, 12 sections, diagrams, colour images and x-rays
Topics will include:
Component packaging
Printed Circuit Board Design & Specification
Printing & AOI
Placement & dipping modules
Dip paste and flux
Convection and vapour phase profiling
Cleaning options
Optical and X-ray inspection
Underfill
Rework & reballing packages
Reliability
POP Process Assembly Defects
PoP Bibliography
