The solder paste and stencil printing photo CD-ROM album featuring over 300 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The images can be downloaded or provided on CD ROM
Images are provided for a range of different component and assembly types like chip, qfp, BGA, LGA, QFN, through hole reflow and other print applications For further information go to http://www.bobwillis.co.uk/product-category/photo-cd-rom/