Apr 01, 2020 
We are running a Charity Webinar with two of the industry's leading magazines Circuits Assembly & Global SMT & Packaging magazine to help support engineers worldwide https://app.greenrope.com/users/myteam45084/Media437.html
Deligates can donate if they like or just enjoy the event. Corportate suppliers can also support if they would like by contacting one of the editors
Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection. This webinar is presented by Bob Willis at 2.30pm UK Time on Wednesday 8th April
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