May 06, 2002 Camtek Ltd., (Nasdaq: CAMT), a developer, manufacturer and marketer of intelligent optical inspection systems and related software products that are used to enhance processes and yields for the Printed Circuit Board (PCB), Semiconductor Packaging and Microelectronics industries, reported today that it has received acceptance for a Bump Inspection System (BIS) from one of the world's leading semiconductor companies.
The system is used for surface and bump inspection and bump metrology in finished wafers prior to their subsequent flip-chip interconnect operation.
"We are pleased to see our state-of-the-art technology adopted by one of the largest suppliers of semiconductors in the world," began Rafi Amit, Camtek's CEO. "As a technology leader, this company's acceptance represents an acknowledgement of the BIS 'best-in-class' measurement accuracy. Moreover, this installation indicates that the BIS is ready to serve the demanding needs of semiconductor manufacturers today," he said.
The BIS applies patent-pending 3-D metrology to inspect the location, diameter, and height of the interconnect bumps. The machine uses a white light spectrographic system to measure bump height, typically delivering a sub-micron accuracy of 0.5 micron, with a standard deviation of 0.3 micron. In addition, the BIS performs two-dimensional bump surface inspection. Revenue from this sale was recognized in the first quarter of the year.
Camtek Ltd. designs, develops, manufactures and markets technologically advanced and cost-effective intelligent optical inspection systems and related software products that are used to enhance processes and yields for the printed circuit boards, semiconductor packaging and microelectronics industries. Camtek is a public company since 2000, with headquarters in Migdal Ha'Emek, Israel and subsidiaries in the US, Europe, Japan, and East Asia.
