SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018

Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018

Apr 24, 2018

Shanghai, China - Under the slogan “True 3D now powered by AI Platform,” Koh Young Technology will highlight its latest connectivity KSMART Process Optimizer (KPO) for optimizing printers in booth 1B60 at NEPCON China from 24-26 April,2018. Pursuing AI-driven automation, Koh Young has been working with its KSMART partners like MPM printer line and EKRA printer line to realize machine connectivity and a zero-defect production line.

Automated Printer Optimization

Due to growing popularity for smaller, lighter, and smarter electronic devices, there has been increasing demand of ultra-fine pitch packages, such as flip chips and chip scale packages in printed circuit board assembly (PCBA), which has made stencil printing much more complicated process. In fact, over 70 percent of soldering defects are associated with the solder paste printing process. Thus, manufacturers must ensure the optimal printing parameters are consistently applied during production.

On the move to Industry 4.0

Defining the optimal process parameters often needs a high degree of expertise, as there are many environmental factors affecting the process. The KSMART Process Optimizer, a key deliverable from the collaborative projects with partner companies, overcomes this challenge by assisting real-time communication of monitoring data from the screen printing process including insufficient paste, shape deformity based on 3D volume, and more.

Real-time Process Optimization

The KSMART Process Optimizer, comprised of three interlinking software modules, supports real-time process optimization by combining real-time printing information with SPI measurement data. REal-time alerts prevent print quality problems and monitor printer hardware engagement and print ready status via Pre DOE, while automatically optimizing printer parameters. It provides real-time alarms based on printing quality during DOE through PDM Lite and verification of printing results following application of recommended parameters resulting in significant print quality improvements and increased yield.

As the absolute leader in SPI and AOI markets, Koh Young will display a broad sampling of its latest developments, as well as the company’s effort for various standard integrations, such as the Hermes Standard for open M2M communication. Koh Young will be putting up The Hermes Standard Logo on their booth and products at booth 1B60. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com. 

About Koh Young Technology, Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure close communication with its growing customers base, while providing them with access to a global network of process experts.

Media Relations and Information Contact:                                                                       

Mailto:  mk_team@kohyoung.com

Apr 30, 2024 -

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference in Denver, Colorado Opening May 28, 2024

Apr 25, 2024 -

Koh Young will Showcase its Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225 on 11-13 June 2024 in Nuremberg, Germany

Mar 19, 2024 -

Koh Young America Appoints Heriberto Cuevas as Sales Team Leader for Mexico and South America

Mar 11, 2024 -

Koh Young Invites Electronics Manufacturers to See Its Data-driven Approach to Inspection at IPC APEX Expo

Feb 26, 2024 -

Koh Young Highlighting its Award-winning Inspection Solutions at IPC APEX EXPO on April 09-11, 2024, in Anaheim, CA

Feb 19, 2024 -

A Confluence of Expertise: Lean Stream, Fuji America Corporation, and Koh Young America Unite to Unveil a New Collaborative Workspace

Feb 07, 2024 -

SMTA Carolinas Chapter In-Person Technical Meeting to Improve SMT Quality with Accuracy and Force Validation

Feb 06, 2024 -

Koh Young Strengthens Mexico Sales Team with Addition of Hector Hernandez

Jan 29, 2024 -

Koh Young Shares Revolutionary Advanced Package Inspection Solutions at the SMTA Wafer-Level Packaging Symposium in Burlingame, CA on 12 February 2024

Jan 23, 2024 -

Koh Young Shares Inspection Solutions at the SMTA Wafer-Level Packaging Symposium12 February 2024

183 more news from Koh Young America, Inc. »

Jun 04, 2024 -

Guide to Metal Fabrications: Tailored Process to Production

Jun 03, 2024 -

PVA to Co-Exhibit with TKT Technology at EV Asia 2024

Jun 03, 2024 -

Accu-Assembly Inc. Expands Component Storage Management with AccuLiFT™ and AccuCart™ Products

Jun 03, 2024 -

TAGARNO Expands U.S. Operations with Enhanced Customer Support

Jun 03, 2024 -

North American EMS Industry Down 2.1 Percent in April

Jun 03, 2024 -

North American PCB Industry Sales Up 9.4 Percent in April

Jun 03, 2024 -

Altus and Fuji Bring 'Factory of the Future' Vision to Life With Technology Event

Jun 03, 2024 -

Clarity in Innovation: Pioneering Functional Optical Solutions

May 31, 2024 -

OMD Types and Techniques

May 30, 2024 -

Selective Wave Soldering Machine: A Guide to Superior Soldering

See electronics manufacturing industry news »

Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018 news release has been viewed 1282 times

  • SMTnet
  • »
  • Industry News
  • »
  • Koh Young Technology to Demo New Level of Connectivity at NEPCON China 2018
ICT Total SMT line Provider