Sep 30, 2019 
10.01.2019 – Atlanta – During a two-day technical workshop in New England, Koh Young America will discuss the important role of solder paste inspection (SPI) to understand and then optimize the solder paste print process to improve printed circuit board assembly production yield. Additionally, Panasonic will discuss how the proven connectivity between its printers and mounters and the Koh Young SPI and Automated Optical Inspection (AOI) equipment will benefit manufacturers with Advanced Process Control (APC). The 2-day Print Process Characterization workshop is scheduled for 23-24 October 2019 at the Westford Regency with live machine demonstrations at the Assembly Products Lab in Chelmsford, MA.
Assembly Products is using two industry-respected engineers from Koh Young and Panasonic to lead the workshop. Mr. Ray Welch is a Sr. Applications Engineer at Koh Young America who focuses on helping customers enhance the effectiveness of their use of SPI to characterize and optimize the paste printing process. “During my sessions, I will present materials that will workshop participants enhance their understanding of SPI,” said Ray. “I want to help manufacturers improve their process by teaching them how to use SPI as a process optimization tool rather than a basic “Go” or “No Go” inspection system.” Specifically, Ray will demonstrate how manufacturers can use Print Process Characterization to fully optimize their printed circuit board assembly process.
For the next phase of the workshop, Assembly Products tapped on Panasonic to discuss mounter connectivity. Mr. Doug Africano is a Solutions Engineer in the Process Automation division of Panasonic Systems Solution Company of North America. He supervises the Panasonic Cloud9 Technology Center in Buffalo Grove, Illinois where he helps showcase total solution offerings from Panasonic and its partners, including Koh Young. In this part of the event, Doug will share details about how the Panasonic Adaptive Process Control (APC) technology, which we have integrated with the Koh Young SPI and AOI systems, can boost production yield and lower manufacturing costs by reducing rework and repair.
To learn more about attending the private event, please visit the Assembly Products website and navigate to the workshop page by visiting https://www.assemblyproducts.us/technology-workshop. If you are unable to join the event in New England, you can still learn more about Koh Young by visiting its website at www.KohYoung.com. Alternatively, visit Koh Young at the i4.0 Connect Forum in Fremont, CA (www.i40connectforum.com), SMTA International in booth 609 (www.SMTA.org/SMTAI), or at SMTA Guadalajara in booth 227 (www.SMTA.org/expos/#guadalajara).
###
About Koh Young Technology Inc.
Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and medical. Beyond its headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the U.S. to ensure a close relationship with its growing customers, while supplying access to a global network of inspection and measurement experts.
Koh Young America Editorial Contact
Brent Fischthal (Media Relations) +1.704.651.2860 Brent.Fischthal@KohYoung.com
