Koh Young 8030 USX SPI for Ultra Large, Heavy Boards Wins the Global Technology Award at Productronica

Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced the USX Series of inspection machines for ultra large and heavy boards wins another innovation award. This time, Global SMT & Packaging acknowledged the new 8030 USX SPI, part of the USX series of inspection machines designed for applications like solder paste inspection (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines with the Best New SPI Product Award. Trevor Galbraith, the Publisher of Global SMT presented the award to Koh Young during Productronica on 14 November 2023 at Messe München in Germany.

"Navigating the evolving landscape of PCBs for demanding applications such as LED, electric vehicles, communications, and storage introduce a significant hurdle with the emergence of large, heavy board designs," explained Brent Fischthal, Head of Global Marketing at Koh Young Technology. "In response, our team engineered and conceptualized the USX Series in close collaboration with manufacturers, providing solutions to effectively tackle these evolving challenges head-on." With solutions for solder paste (SPI), components and solder joints (AOI), and dispensed materials (DPI/CCI) like conformal coating, underfill, and flux, the USX Series handles 1,800mm (70 inch) long boards weighing upwards of 15kg (33lbs), while still delivering all the fundamental measurement-based inspection capabilities that made Koh Young the global market leader.

As part of its award-winning USX Series line-up, the newly introduced 8030 USX continues to deliver on Koh Young’s promise to deliver critical inspection solutions to eliminate process issues and maximize production quality. Besides increased board handling capabilities, features like active warp compensation, pad-referencing, self-diagnosing maintenance, automated process controls, and foreign material inspection are just some features manufacturers can use to improve yields.

We revolutionized the inspection process years ago with our innovative technology and became the market leader. Today, based on that proven 3D measurement-based technology, Koh Young continues to conquer new manufacturing challenges facing our industry with solutions optimized for extra-long and heavy board applications.

You can explore our solder paste inspection and award-winning True3D inspection solutions at www.kohyoungamerica.com or through these FREE downloads from Koh Young:

• The Printed Circuit Assembler's Guide to...SMT Inspection: Today, Tomorrow, and Beyond eBook
  • https://iconnect007.com/my-i-connect007/books/inspection/
• The Companion Guide to…SMT Inspection: Today, Tomorrow, and Beyond eBook
  • https://iconnect007.com/my-i-connect007/books/kycg/
• The Smart Factory: AI-based Closed-loop Self-Optimization Platform article
  • https://kohyoungamerica.com/smart-factory-in-electronics-manufacturing-ai-based-closed-loop-self-organization-platfrom/
• The Koh Young Story: 20-years of Innovation article
  • https://kohyoungamerica.com/the-koh-young-story-twenty-years-of-innovation/