Aug 14, 2012 Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario. The addition of CWI by Hesse & Knipps is the company’s latest strategic move to strengthen rep coverage and customer support for its family of wedge bonders including fine wire wedge bonders, ribbon bonders, and heavy wire bonders.
“CWI Technical Sales will be a valuable resource in establishing long-term customer relationships in the Eastern portion of the United States and Eastern Canada, especially the emerging Hudson (Tech) Valley region,” notes Joseph S. Bubel, President of Hesse & Knipps, Inc. “CWI’s extensive knowledge and experience in microelectronic assembly and test, as well as bonding & inspection equipment, enables them to quickly and accurately assess application requirements and recommend an ideal course of action for Hesse & Knipps’ wire bonder customers.”
For more than 30 years, CWI has represented tier-one equipment suppliers on the east coast, offering top quality products and solutions in the test & measurement, wafer processing, inspection/metrology, backend operations and failure analysis areas. A hands-on organization, CWI employs a technical service support staff highly knowledgeable in hardware, software and automation that understand how products operate and apply to customer applications.
“Hesse & Knipp’s line of advanced wedge bonding systems are a perfect complement to our existing device packaging line card,” confirms Nat Weil, CWI Founder and President. “We are extremely pleased to be representing Hesse & Knipps and join a team that we have admired for many years.“
CWI Technical Sales is a manufacturers' representative organization offering products & solutions to the semiconductor, optoelectronic, wireless, defense/aerospace, life sciences and other related industries. Located in Central New Jersey, the company has been representing tier-one equipment suppliers on the east coast for over 30 years. These companies offer products in the test & measurement, wafer processing, inspection/metrology, backend operations and failure analysis areas. For more information, please visit http://cwitechsales.com/index.html.
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.
For more information, please visit the company’s website at www.hesse-knipps.com.
