Jun 05, 2012 
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces two next-generation conductive grid inks, CI-1031-7 and CI-1031-8, for use in thin-film solar modules. These material formulations have been optimized for excellent conductivity and low contact resistance on transparent conductive oxides used in solar applications.
The CI-1031-series conductive grid inks have high solids contents and optimized rheologies to enable screen printing of high aspect ratio fine lines to maximize the print thickness and reduce shadowing. These are low stress, low shrinkage thermosetting inks that offer excellent moisture resistance and low polymeric creep. Line resistivity is very low at 8 mΩ/sq/mil (1 mil emulsion; 230 mesh).
CI-1031-7and CI-1031-8 are the latest additions to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.
For more information about the CI-1031-7 and CI-1031-8 Conductive Grid Inks or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.
Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication that compliments EMS’s circuit assembly product line. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.
