Sep 13, 2017 Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.
Dry-films are available in thickness formats from 5 to 120 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The EMS resists are tougher (less brittle) than most negative photo resists on the market and are hydrophobic in nature providing for chemical and moisture resistance. The dry-films are compatible with and can be used in contact with the EMS line of spin coatable photoresists.
Please stop by the Engineered Materials Systems booth #56 to discuss the company’s full line of film and liquid negative photo resists formulated for fabricating microfluidic channels and sealing through silicon vias.
For more information about the liquid and dry-film negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.
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