SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Mar 08, 2018

The DF-3500 series.

The DF-3500 series.

Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials, is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

The DF-3500 series resists can be used as via caps or as a continuous passivation layer. When used in conjunction with the 412-17 EMS adhesion promoter, the resist is capable of surviving HAST testing on sealed vias. These dry-films are capable of extreme fine line and space definition in complex patterns with resolutions down to 3um for the thinnest films. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.

EMS DF-3500 dry-film photoresists are tougher (less brittle) than other negative photoresists on the market with glass transition temperatures ranging from 120°C (by DMA Tan Delta) to 200˚C. They are hydrophobic in nature, providing chemical and moisture resistance. EMS dry-films are compatible with and can be used in contact with the EMS line of spin-coatable negative tone photoresists.

The DF-3500 series film negative photoresists are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for lift off processes, via sealing and making microfluidic channels on MEMS devices.

For more information about the dry film negative photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Dec 04, 2019 -

Engineered Material Systems Introduces Linear Resistance Carbon Inks

Jun 15, 2019 -

Engineered Material Systems Introduces Durable Printed Electronics with SMT

May 13, 2019 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Apr 15, 2019 -

Engineered Material Systems to Showcase Electrically Conductive Adhesives at Intersolar Europe

Feb 21, 2019 -

EMS Introduces Spin on Liquid Negative Photoresist NR-5000

Jan 15, 2019 -

Engineered Material Systems Introduces New High thermal Conductivity Die and Component Attach Adhesive

Sep 27, 2018 -

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Sep 13, 2018 -

Engineered Material Systems to Showcase Next-Generation Electrically Conductive Adhesives at EU PVSEC

Sep 05, 2018 -

Engineered Material Systems Introduces New Low-Temperature Cure, Low-Cost, Electrically Conductive Adhesive

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

67 more news from Engineered Materials Systems, Inc. »

Jul 16, 2024 -

ViTrox Announces Exciting New Partnership with Hitronix Technology and Key Hire to Enhance Sales and Support Services in Brazil

Jul 16, 2024 -

Elevate Your PCB Handling Efficiency with Our Advanced Solutions!

Jul 15, 2024 -

Automatic Nozzle Height Adjustment Reduces Soldering Defects in Wave Soldering Processes

Jul 15, 2024 -

KIC to Exhibit at Four SMTA Expo & Tech Forums in August

Jul 15, 2024 -

BTU International Appoints E-Tronix as Its Representative in Six States

Jul 15, 2024 -

TAGARNO Achieves Record Sales in the US for Q2 2024

Jul 15, 2024 -

Register for ZESTRON's Upcoming Webinar on "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs"

Jul 15, 2024 -

SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification

Jul 15, 2024 -

Altus Enhances Sustainability with kolb's Recyclable Packaging

Jul 12, 2024 -

Feeder Finger Releases Leaderless Feeder for Europlacer

See electronics manufacturing industry news »

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers news release has been viewed 1732 times

  • SMTnet
  • »
  • Industry News
  • »
  • EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers
convection smt reflow ovens

Reflow Oven