May 13, 2015 The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices. While miniaturization has afforded consumers with convenience and greater ease of use, manufacturers have been faced with problematic issues in light of the reduction of the standard bump size in 3D packaging from 80 µ to 10 µ. Using nanoformulations, YINCAE Engineers have successfully crafted an array of solutions in response to issues that standard underfills have, particularly with flowability through the gaps between the bumps ≤ 10 µ.
In a recent study examining standard underfills for multilayer low bump 3D Packaging, YINCAE Advanced Material’s SMT 158 was compared against three other standard manufacturing underfill materials from leading suppliers. The results of this comparison are astounding. In reliability testing that included thermal cycling, flowability and pressure cooking, SMT 158 outperformed the other three materials in every stage of testing. Most noteworthy perhaps is that SMT 158 can flow up to 4 times faster than the other three. The thermal cycling for the other three materials ranged from 800-1000 cycles before failure. SMT 158 did not fail until 3500 cycles, indicating a significance of reliability that far exceeds current industry standards.
With industry advancements using nanotechnology, the need to improve or completely eliminate undefill is imminent. YINCAE offers Advanced Material solutions that far exceeds the standard manufacturing protocol with smaller filler particulate and significantly faster curing underfill in addition to solder joint encapsulation adhesives that can be used in place of underfill at the same point in any reflow profile. Be sure to visit our web page www.yincae.com to learn more.
