Jan 24, 2017 (Albany, NY) January 24, 2017 – BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available, is currently being used for ball bumping applications. Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com. If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.
