Mar 02, 2026 ZESTRON, a global leader in precision cleaning products, services, and training for the electronics manufacturing and semiconductor industries, is pleased to announce its participation in IPC APEX EXPO 2026. The premier event for electronics manufacturing will be held March 17–19, 2026, at the Anaheim Convention Center in Anaheim, CA.
As a trusted partner to electronics manufacturers worldwide, ZESTRON is committed to delivering innovative cleaning solutions that address the industry’s evolving needs for performance and reliability. The company will emphasize its support for high-reliability and Class 3 applications across industries such as medical devices, electric vehicles, ADAS, defense, and other high-voltage technologies including charging stations, inverters, and communication satellites. Attendees will have the opportunity to engage directly with ZESTRON’s technical experts at Booth #1420 to discuss their specific challenges.
In addition to exhibiting, ZESTRON’s Principal Engineer Ravi Parthasarathy will present “Evaluating OSP Finish Robustness Under Multiple Cleaning and Soldering Exposures Using a Multi-Variable DOE Approach” on Tuesday, March 17th. The study discusses the reliability of standard and premium OSP surface finishes under thermal and chemical process stresses. The research evaluates degradation behavior using IPC visual criteria, solderability testing, SERA analysis, and UV-VIS measurements.
A second study conducted by ZESTRON Europe’s Dr. Olaf Schoenfeld and titled “Driving Reliability Through Technical Cleanliness: Correlating HV Tests with Geometrical Particle Metrics,” will be presented by Director of Strategy and Business Devleopment Jeffrey Kennedy on Tuesday, March 17th. The presentation will showcase an advanced cleanliness assessment approach for high-voltage EV powertrain components that goes beyond traditional particle metrics outlined in Component Cleanliness Code. By integrating electrical and material analysis techniques, the methodology hones in on critical particle identification at operating voltage and improves contamination risk detection. Inclusion of this methodology as a risk analysis tool aims to improve reliability and set appropriate design specifications.
Senior Application Engineer Kalyan Nukala will also present “Advancements in Jetting and Screen-Printable Solder Pastes: Cleaning Compatibility for Complex Semiconductor and Electronic Assemblies” on Wednesday March 18th. Conducted and presented in collaboration with Indium Corporation, the study examines cleaning compatibility between solder paste jetting and traditional screen-printable pastes as miniaturization drives increased adoption of jetting technology. The session will highlight how differences in metal load and bond-line thickness affect cleaning performance and share comparative results to determine optimal chemistries, equipment types, and process parameters for each paste.
To learn more about ZESTRON’s cleaning solutions for high-reliability applications, visit Booth #1420 in the exhibition hall at the IPC APEX EXPO.
ZESTRON is headquartered in Manassas, Virginia, and operates in over 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our technical centers, please visit www.zestron.com.
