Jun 05, 2014 
AI Technology, Inc. (AIT) introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
COOL-GUMPAD™ CGP7156 dispenses like a thermal pad with immediate high performance. When the module operates and heats to above 45°C, the interface pad (COOL-GUMPAD™ CGP7156) will melt-flow to provide the lowest thermal interface even in comparison to the best of thermal greases.
Side-by-side performance measurements demonstrate that, compared to standard pads in LED luminaire lights, COOL-GUMPAD™ CGP7156 lowers the temperature by 10-20% and lowers the heat-sink to module junction temperature from 60°C to less than 56°C. COOL-GUMPAD™ CGP7156 has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing.
COOL-GUMPAD™ CGP7156 is optimized to accommodate large areas with different heights and gaps of less than 3-mil along its interfacing area. It is filled with a modified boron nitride admixture and is electrically insulating at normal voltage. It is designed to have high compressibility as applied in comparison to traditional thermal pads. Once the device temperature reaches 45°C, COOL-GUMPAD™ CGP7156 will "melt-flow" to fill even the smallest of trapped air along the interface between the device and heat-sink or heat-spreader.
COOL-GUMPAD™ CGP7156 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications of outdoor LED lighting. Of course, the same phase-change pad works great for large area power modules, power converters for solar panels and metal core printed circuit boards populated with components that have substantial height differentials.
COOL-GUMPAD™ CGP7156 is semi-tacky on both sides for optimum thermal transfer performance – two release liners keep the tacky sides clean, however the liners are easily removed. The pad can be cut to accommodate custom sizes. COOL-GUMPAD™ CGP7156 is available in 40 mil (1.0mm) and 20 mil (.5mm) thicknesses.
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. (AIT) has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology, Inc. (AIT) offers some of the most reliable adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications. AIT’s thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics. For an application analysis: http://www.aitechnology.com/analysis/
Media Contact: Amy Grossman, (609) 799-9388, agrossman@aitechnoloy.com
