Feb 16, 2026 KOKI Solder America, a global leader in advanced soldering materials, is pleased to announce its participation as both an exhibitor and technical presenter at the 22nd Annual Device Packaging Conference (DPC 2026), hosted by the International Microelectronics Assembly and Packaging Society (iMAPS). The conference will take place March 2–5, 2026, in Phoenix, Arizona, and serves as a premier international forum for innovation in microelectronics assembly and device packaging.
KOKI Solder America will exhibit at Booth 710. In addition, Shantanu Joshi, Head of Customer Solutions and Operational Excellence, will deliver a technical presentation titled:
“A Zero-Flux Residue Soldering Solution for Power Devices with Formic Acid Reflow”
The presentation is scheduled for Thursday, March 5, from 10:00 to 10:30 AM, and will focus on E14, a lead-free solder paste within KOKI’s E Series, developed specifically for vacuum and formic acid reflow processes.
The E14 Series is engineered to reduce oxidation during vacuum reflow and is well-suited for power semiconductor applications, including MOSFETs and IGBTs. By eliminating flux residue after reflow, E14 removes the need for post-solder cleaning, helping to prevent interference with downstream processes such as wire bonding and molding.
Key features of the E14 Series include:
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Residue-free soldering with no post-reflow cleaning required
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Ultra-low voiding and high solder joint quality
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Availability in multiple alloys (SAC305, Sn3.5Ag, Sn5Sb)
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Offered in IPC Type 3, Type 4, and Type 6 powder sizes
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Suitable for both stencil printing and dispensing applications
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Halogen-free compliance per BS EN 14582 (Br + Cl < 1500 ppm)
Beyond materials, KOKI Solder America provides comprehensive technical support, including product verification, defect analysis, and process optimization. Acting as an extension of its customers’ engineering teams, KOKI supports reliable, stable, and efficient manufacturing outcomes.
For more information about KOKI, the E14 Series, and other soldering solutions, please visit https://koki-global.com/.
Founded in 1964, KOKI is a global leader in advanced soldering materials, focused on innovation, sustainability, and regulatory compliance. In addition to its materials portfolio, KOKI offers in-depth technical services and analytical support to help customers optimize soldering performance across a wide range of applications worldwide.
