SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Stabilize Cost. Strengthen Reliability. KOKI Showcases BIG Low-Ag and ICT-Ready Solutions at APEX 2026

Stabilize Cost. Strengthen Reliability. KOKI Showcases BIG Low-Ag and ICT-Ready Solutions at APEX 2026

Mar 12, 2026

KOKI Solder America, a global leader in advanced soldering materialsannounces that it will be exhibiting at IPC APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California. Attendees can visit KOKI at Booth 1323 to explore high-performance soldering solutions engineered for cost stability, reliability, and modern test environments.

BIG Series; Low-Ag. High Confidence.

At APEX 2026, KOKI will spotlight its BIG Low-Ag Alloy Series, a high-reliability, cost-saving lead-free solder paste platform designed as a strategic alternative to SAC305.

With ongoing silver price volatility impacting manufacturing costs, the BIG Series provides a smart path forward:

  • 40–60% cost reduction versus SAC305

  • Fully compatible with standard SAC305 reflow profiles

  • Strong wetting performance and controlled voiding

  • Reliability validated through strain-stress (SS) curves and BGA drop testing

By carefully optimizing additive elements, including bismuth, KOKI engineered the BIG platform to align the liquidus temperature with that of SAC305, allowing manufacturers to maintain existing process parameters while reducing material cost exposure.

The result: reduced cost, maintained process stability, and improved long-term reliability confidence.

S3X58-HF960 – Built to Pass, Not Just Print

Also featured at Booth 1323 is S3X58-HF960, KOKI’s halogen-free solder paste specifically engineered for ICT environments.

While many solder pastes are optimized for print performance alone, S3X58-HF960 was developed with downstream testing in mind. Its formulation leaves almost zero flux residue on top of the solder joint, enabling:

  • Cleaner probe contact

  • Reduced ICT pin clogging

  • Improved test yield

  • Greater ICT reliability

  • Fewer false failures that slow production

In today’s high-mix, high-reliability manufacturing landscape, test yield directly impacts throughput and profitability. S3X58-HF960 helps protect both.

In addition to its material portfolio, KOKI Solder America will highlight its analytical and technical support capabilities. From solder joint analysis and failure evaluation to process optimization and reliability validation, KOKI’s team works alongside manufacturers to diagnose issues, validate improvements, and support continuous process control.

Whether a long-standing customer or a manufacturer simply facing a challenging soldering issue, KOKI positions itself as an extension of the engineering team, providing data-driven insight, metallurgical expertise, and practical solutions that translate to measurable production improvements.

Book a meeting today to get the discussion started: https://survey.zohopublic.com/zs/RYDFzh


Founded in 1964, KOKI is a global leader in advanced soldering materials, focused on innovation, sustainability, and regulatory compliance. In addition to its materials portfolio, KOKI offers in-depth technical services and analytical support to help customers optimize soldering performance across a wide range of applications worldwide.

Mar 30, 2026 -

KOKI Europe Highlights S3X58-HF1200 Lead-Free Solder Paste for Low Voiding, Stable Reflow Performance, and Extended Shelf Life

Feb 16, 2026 -

KOKI Solder America to Exhibit and Present E Series Zero Flux Residue Technology at iMAPS Device Packaging Conference 2026

Nov 17, 2025 -

KOKI to Host Technical Webinar on Dewetting Defects in SMT Soldering

Oct 27, 2025 -

KOKI Solder America and Ikeuchi USA Announce Joint Webinar on Solder Paste Reliability and Humidity Control in SMT Manufacturing

Oct 06, 2025 -

KOKI to Exhibit at SMTAI 2025 and Showcase Crack Free & Moisture Resistant Solder Paste

Sep 03, 2025 -

KOKI Announces Upcoming Webinar on Enhancing Solder Joint Reliability

Aug 04, 2025 -

KOKI Relocates to Support Continued U.S. Growth

Aug 04, 2025 -

KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025

May 19, 2025 -

KOKI Announces Upcoming Webinar on a Residue-Free Soldering Solution for Power Devices Using Formic Acid Reflow

Apr 29, 2025 -

KOKI Expands U.S. Sales Coverage with Multiple New Representatives

6 more news from Koki Company LTD »

Apr 06, 2026 -

Weiner International Associates Announces Executive Management Forum at PCB East 2026

Apr 06, 2026 -

PVA to Highlight Proven Conformal Coating Technology with ICCO EMT at InnoElectro 2026

Apr 06, 2026 -

Express Manufacturing, Inc. Enhances Test Capabilities with TAKAYA APT-1600FD-SL Investment

Apr 06, 2026 -

Apollo Seiko Boosts Soldering Speed and Precision with J-CAT LYRA at Electrical Wire Expo

Apr 06, 2026 -

EVS International Brings High-Impact Solder Recovery Technology to productronica India

Apr 06, 2026 -

DISTRON CORPORATION Expands In-House Capabilities with Automated Conformal Coating for Complex PCB Assemblies

Apr 06, 2026 -

ViTrox's V810Ai QX1 AXI has been honoured with the prestigious 2026 New Product Introduction (NPI) Award by Circuits Assembly

Apr 06, 2026 -

Solderstar Appoints Scanditron as Nordic and Baltic Distribution Partner

Apr 06, 2026 -

Kurtz Ersa Brings Selective Soldering and Large-Board Rework Power to EPTECH Toronto and Montreal

Apr 06, 2026 -

PVA and Maxim SMT Bring Next-Generation Coating and Dispensing Technology to productronica India 2026

See electronics manufacturing industry news »

  • SMTnet
  • »
  • Industry News
  • »
  • Stabilize Cost. Strengthen Reliability. KOKI Showcases BIG Low-Ag and ICT-Ready Solutions at APEX 2026
IPC Training & Certification - Blackfox