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Aug 02, 2017 | As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Dec 21, 2016 | Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Dec 21, 2016 | Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Dec 21, 2016 | Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Dec 02, 2016 | One of the most exciting additions in version 5.8 of the Condor Sigma software is automatic grading for ball shear testing. Using the advanced Halcon library and high resolution perpendicular cameras with smart lighting systems, we have achieved successful determinations of failure modes for several customers. The computer can accurately determine the percentages of brittle and ductile failures.
Nov 02, 2016 | The market leading bond tester Condor Sigma can be equipped with a camera to do motion and strain analysis. It includes a wide variety of visualization options.
Sep 30, 2016 | In this newsletter we describe a new method of testing the seal and adhesive quality of a lid encapsulated devices.
Sep 08, 2016 | This week, XYZTEC is exhibiting the Condor Sigma at Semicon Taiwan. With two booths at the central TWTC Nangang Hall (4F), the market leader in bond testing is attracting a lot of attention. Many customers are automating their facilities and therefore come to see the latest advances in automation that the Condor Sigma and the 300mm (12 inch) wafer testing Condor Sigma W12 have to offer.
Sep 02, 2016 | We present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C. The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating.
Aug 23, 2016 | High Technology and Materials Group (HTMG) recently signed on as XYZTEC's exclusive sales and service representative for Brazil. HTMG has its headquarters in Sao Paulo, Brazil and offers high performance innovations in components and materials to several business areas in South America since 1999.