SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers

MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers

Apr 14, 2020

More consistent edge-to-edge prints by removing the interference of top clamps and allowing optimal PCB to stencil gasketing

More consistent edge-to-edge prints by removing the interference of top clamps and allowing optimal PCB to stencil gasketing

ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.

The new board staging feature offers the ability to have three boards in the machine simultaneously. Reduced distance on the input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time and throughput.

The new EdgeLoc II board clamping system securely holds the board during printing using a side snugging technique. This removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. A large, flat squeegee landing area protects the squeegee blade and stencil from damage. Robust flippers engage to secure the board across the top edge to ensure board flatness and remove any warpage. The board is then gripped from the side with software-controlled pressure before the flippers move out of the way for printing.

The MPM Edison also offers board clamping that can change between edge and top clamping with a simple software selection. EdgeLoc+ can hold thin boards with the top clamps while simultaneously adding light edge clamping force for maximum flexibility.

“We will be presenting the new EdgeLoc board clamping and board staging features for Edison at the upcoming Productronica show,” said Wayne Wang, MPM Business Manager. “We are developing new technology for the entire MPM printer line to meet the needs of the market through customer back innovation.”


ITW EAE, a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology. For more information visit www.itweae.com.

Nov 21, 2022 -

ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

Aug 28, 2020 -

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Apr 14, 2020 -

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Apr 14, 2020 -

MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models

Apr 14, 2020 -

Electrovert 'DwellFlex 4.0' Wave Solder Nozzle Wins New Product Innovation Award at IPC APEX 2020

Apr 14, 2020 -

Camalot Announces PCB Temperature Monitoring on Prodigy Dispenser to Ensure Underfill Process Stability

Apr 14, 2020 -

ITW EAE Receives Patent No. 10,434,537 for Camalot® Prodigy's™ Dynamic Dual Head™ Dispensing Technology

Apr 14, 2020 -

ITW EAE Wins Global Technology Award for the Camalot Prodigy's Dynamic Dual Head Dispensing Technology

Nov 05, 2019 -

MPM Introduces Next Generation Momentum II Printer

Oct 15, 2019 -

MPM to Present Technical Paper on Stencil Printing 0201 metric Apertures at Productronica

11 more news from ITW EAE »

Jul 12, 2024 -

Feeder Finger Releases Leaderless Feeder for Europlacer

Jul 11, 2024 -

Approaching Shannon's Limit: KDPOF Evolves to KD

Jul 09, 2024 -

Guide to Sourcing Top-Quality Lighting from Asia

Jul 08, 2024 -

Electronics Industry Sentiment Falls in June, Driven by Weaker Demand and Stronger Cost Pressures

Jul 08, 2024 -

StenTech Expands Sales Representation to Enhance Service in SoCal / Arizona / Southern Nevada Territory

Jul 08, 2024 -

EVS International to Demonstrate Unprecedented Solder Recovery at the Penang Manufacturing Expo 2024

Jul 08, 2024 -

PDR REWORK FOCUSED INFRARED HEATING & PLACEMENT TECHNOLOGY

Jul 08, 2024 -

Seica Expands Testing Capabilities in Mexico to Serve Thriving Electronics Industry

Jul 08, 2024 -

TAGARNO Promotes Jake Kurth to Vice President of Technical Sales Amid U.S. Expansion

Jul 08, 2024 -

Ventec International Group Earns IPC-4101 QPL Requalification

See electronics manufacturing industry news »

MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers news release has been viewed 1112 times

  • SMTnet
  • »
  • Industry News
  • »
  • MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers
ICT Total SMT line Provider

Baja Bid Auction JUL 9-10, 2024