Common Failures And Solutions Of Pick And Place Machine?

1. SMT pick and place machine does not start fault alarm analysis and troubleshooting methods

a. The machine's emergency switch is on: pull out the emergency switch button.
b. The solenoid valve is not started: repair solenoid valve.
c. Interlock switch off: switch on the interlock.
d.Insufficient air pressure: check the air source and bring the air pressure up to the required value.
e. Computer malfunction: restart after shutdown.
 

2. Analysis and troubleshooting of SMT stillness mounting head

a. Poor contact or short circuit with a transversal transmitter or sensor: Check and repair the transmitter or sensor.
b. Poor contact or short circuit of longitudinal transmitter or sensor: Check and repair the transmitter or sensor.
c. Too much lubricating oil, sensor contamination: Oil must not be too much, clean the sensor.
 

3. Failure analysis and troubleshooting method for PCB not to go forward on SMT patch machine

a. The belt of the PCB transporter is loose or broken, Replace the belt of the PCB transmitter
b. There is dirt or a short circuit on the sensor of the PCB transmitter: wipe the sensor of the PCB transmitter.
c. Too much lubricating oil, sensor contamination: Oil must not be too much, clean the sensor.
 

4. Fault analysis and troubleshooting of SMT patch machine picking up errors

Mounting heads cannot pick up components, The position of the component picked up by the mounting head is offset; During movement, the component falls off the mounting head.
a. Nozzles wear and aging, cracks caused air leakage: replace the nozzles.
b. There is some dirt such as solder paste under the suction nozzle: The orifice of nozzles is clogged with dirt, Wipe the bottom side, Open the orifice with a fine needle.
c. The orifice size of nozzles does not match the components: replace the nozzles.
d. There is a problem with the inlet or outlet of the vacuum pipeline and filter. There is no vacuum or incomplete vacuum(Cannot hear exhaust/vacuum valve LED not on / insufficient vacuum pressure at the inlet of the filter), Check vacuum piping and joints for leakage. Reconnect or replace the air duct, replace the connection or air pipe.
e. The surface of components is uneven (We have found that the surface of the µf capacitor is uneven): Replace qualified components.
f. Components stick to the bottom strip, The rough edges of the braided holes jam the components, The pins of the components are stuck at the corner of the band socket, The gap between the components and the braided hole is not large enough: Remove the plastic tape and reverse the tape to see if the components fall off by themselves.
g. The plastic tape on the surface of the component is too sticky or not strong, the plastic tape does not unfold properly, or plastic tape torn from the edges: Check the plastic tape as it expands and rolls up, reinstall feeder or replace components.
h.Incorrect selection of suction nozzle, components or feeders.
 

5. Fault analysis and troubleshooting of SMT pick and place machine

• Wrong attachment of components or wrong polarity direction.
  a. Patch programming error: modify patch program.
  b. Pickup programming error or loading wrong feeder position: modify the pickup program and change the feed station.
  c. Polarity components such as the transistor, the electrolytic capacitor, etc., have different directions for tape braiding from different manufacturers: when replacing the tape component, pay attention to the polarity direction, and modify the patch program when inconsistency is found.
  d. The direction of feeding is inconsistent with the programming direction of feeding device when adding the tube to the feeding channel of vibrating feeder: pay attention to the direction of the device when feeding the feeding channel of vibrating feeder.

• SMT pick and place machine mounting position deviates from the coordinate position
  a. Patch programming error: modify component coordinates when the individual component position is not accurate; The PCB Mark can be modified as a whole board offset.
  b. Error setting of component thickness: modify component library program.
  c. The height of the patch head is too high and the component is dropped from the height when the patch is applied: reset the height of the Z axis so that the distance between the bottom of the solder end and the surface of the PCB is equal to the diameter of the maximum solder ball.
  d. The chip head is too low to slide the element: Reset z-axis height so that the distance between the bottom of the component solder end and the surface of the PCB is equal to the diameter of the maximum solder ball.
  e. Fast mounting speed; X, Y, Z and Angle T too fast: slow down.

• The components are cracked or damaged when attached
  a. PCB deformation: replace the PCB or heat and pressure the PCB.
  b. The height of the pasting head is too low: the height of pasting head should be adjusted according to the thickness of PCB and the height of pasted components.
  c. Excessive mounting pressure: adjust mounting pressure again.
  d. The size of PCB support pillars is incorrect, and the distribution of PCB support pillars is uneven: the number of support pillars is too small, and the support pillars that match the thickness of PCB are replaced to distribute evenly. Add support columns.
  e. The component itself is fragile: replace the component.