Sep 04, 2019 Laserssel has announced they will exhibit in booth #1109 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, IL.
“I look forward to attending the exhibition and talking to as many people as I can about our LSR technology,” commented Denis Barbini, Ph.D, Managing Director of the USA for Laserssel. “SMTA International is a highly attended show and I invite anyone with the desire to reduce their typical reflow oven’s 8-minute cycle down to just 10 seconds to stop by booth #1109 at the show!”
Laser Selective Reflow (LSR) is designed to deliver a uniform, defocused laser beam over a specifically tailored area on a PCB. The uniform defocused beam is controlled and delivered to the product via the BSOM (Beam Shaping Optic Module system) on user defined area. This unique feature permits the user to implement novel soldering solutions not possible with conventional techniques. It also allows the selective application of energy to locations that require soldering while not heating up potentially thermally sensitive areas. LSR is potentially a means to also mitigate or even eliminate the warpage of various packages. It provides a reliable, robust, high yielding and fast, only 1~6 seconds laser soldering time per selected area. It is made possible by highly uniform optic system and distinctive recipe developed by Laserssel.
To learn more about Laserssel, please visit the company at Booth #1109 at SMTA International, or visit www.laserssel.com.
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semi-conductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process. Combined with its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices. Please visit www.laserssel.com for more information.
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