SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson Electronics Solutions to feature high-throughput fluid dispensing technologies for wafer-level and panel-level packaging at SEMICON Taiwan 2024

Nordson Electronics Solutions to feature high-throughput fluid dispensing technologies for wafer-level and panel-level packaging at SEMICON Taiwan 2024

Sep 02, 2024

Technologies from Nordson Electronics Solutions are being developed to address challenges during the fluid dispensing process for semiconductor applications. Especially for wafer-level and panel-level packaging, these technologies ensure high-throughput, precise dispense results within the same footprint as current equipment.

Technologies from Nordson Electronics Solutions are being developed to address challenges during the fluid dispensing process for semiconductor applications. Especially for wafer-level and panel-level packaging, these technologies ensure high-throughput, precise dispense results within the same footprint as current equipment.

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.  

On display will be the ASYMTEK Forte® fluid dispensing system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), and handling the challenges of warpage during fluid dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.

Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, September 4-6, 2024.


Nordson Electronics Solutions makes reliable electronics an everyday reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, printed circuit board, and precision assembly manufacturers with the innovative fluid dispensing and surface treatment solutions they need to protect sensitive electronics. Day after day, year after year, across the globe, for 40 years, we've delivered cutting-edge engineering and applications excellence to help our customers succeed. 


Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics, and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

May 06, 2024 -

Nordson Electronics Solutions receives EM China Innovation award for the new ASYMTEK Select Coat® SL-1040 Conformal Coating System

Apr 08, 2024 -

Nordson Electronics Solutions expands the SELECT® Synchro™ selective soldering equipment family with new Synchro 3 release

Mar 11, 2024 -

Nordson Electronics Solutions to demonstrate plasma treatment and automated fluid dispensing systems for electronics manufacturing at SEMICON China 2024

Oct 30, 2023 -

Nordson ELECTRONICS SOLUTIONS showcases new products for electronics manufacturing at Productronica 2023

Jul 03, 2023 -

Nordson Electronics Solutions to demonstrate popular automated fluid dispensing systems for microelectronics manufacturing at SEMICON China 2023

Dec 07, 2022 -

Nordson Electronics Solutions introduces new SELECT Synchro selective soldering system to increase throughput and flexibility while reducing footprint and cost-of-ownership

Jul 16, 2022 -

Assure PRO Intelligent X-ray Component Counter Now Available at Demo Location in Florida

May 05, 2022 -

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Apr 20, 2022 -

Nordson Electronics Solutions offers their latest dispensing, conformal coating, and selective soldering technologies at SMTConnect 2022

Sep 03, 2024 -

XJTAG Shows the Benefits of Boundary Scan at FPGAworld

Sep 02, 2024 -

Libra Industries Celebrates Opening of New Manufacturing Clean Room in Dayton, OH

Sep 02, 2024 -

Hanwha Techwin Automation Americas Announces Distribution Partnership with Neotel Technology in the Americas

Sep 02, 2024 -

IPC's Road to Reliability Webinar Series Covers New e-Mobility Technologies

Sep 02, 2024 -

Nordson Electronics Solutions to feature high-throughput fluid dispensing technologies for wafer-level and panel-level packaging at SEMICON Taiwan 2024

Sep 02, 2024 -

CalcuQuote Enhances Procurement Efficiency with Texas Instruments' Backlog API Suite Integration

Sep 02, 2024 -

NEOTech Enhances Manufacturing Edge with New Integrated Microelectronics and SMT Assembly Expansion

Sep 02, 2024 -

TAGARNO Introduces New Product Configurator for the T50 Digital Microscope

Sep 02, 2024 -

Free Webinar on "Surface Reliability--Overcoming Challenges in SMT PCB Manufacturing and Determining Root Causes for Improved Performance"

Sep 02, 2024 -

North American PCB Industry Sales Down 21.2 Percent in July

See electronics manufacturing industry news »

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson Electronics Solutions to feature high-throughput fluid dispensing technologies for wafer-level and panel-level packaging at SEMICON Taiwan 2024
Conductive Adhesive & Non-Conductive Adhesive Dispensing

Reflow Oven