Sep 10, 2020 | Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.
Sep 06, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Aug 28, 2020 | Indium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar with SEMI at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) on Thursday, Sept. 17.
Aug 22, 2020 | Indium Corporation's Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will host an InSIDER Series webinar focused on solder paste attributes and their impact on increased product service life reliability requirements. The webinar will be presented on Webex, Wednesday, Sept. 2 at 9 a.m. Eastern Time (2 p.m. British Time/9 p.m. Malaysia Time).
Aug 22, 2020 | Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Aug 07, 2020 | Indium Corporation now offers Chinese-language webinars as part of its InSIDER Series program. The first Chinese webinar of the series was recently hosted by Dr. Ning-Cheng Lee, Vice President of Technology, who discussed defect elimination in thermal management.
Jul 22, 2020 | Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).
Jul 22, 2020 | Indium Corporation's Jenny Gallery, Product Specialist, will host a webinar focused on gold-based thermal solutions for 5G connectivity. There will be two sessions on Wednesday, Aug. 5, during International Microwave Symposium's (IMS) virtual conference. The first session will be held at 8 a.m. Eastern Time (1 p.m. British Time/8 p.m. Malaysia Time), with the second at 2 p.m. Eastern Time (7 p.m. British Time/2 a.m., Aug. 6, Malaysia Time).
Jul 22, 2020 | Indium Corporation has released a report on the worldwide availability of indium and gallium metal.
Jul 22, 2020 | Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.
Jul 14, 2020 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.
Jul 07, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an InSIDER Series webinar focused on the company's innovative low-temperature solder offering on July 21 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Jun 18, 2020 | Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.
May 12, 2020 | Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.
Jan 10, 2020 | Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress of Smart Materials 2020, March 11-13, 2020, in Barcelona, Spain.
Nov 12, 2019 | Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program.
Apr 23, 2019 | IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.
Apr 17, 2019 | Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and China. The company’s headquarters in Clinton, NY, USA has also achieved IATF 16949 certification.
Apr 15, 2019 | Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Apr 14, 2019 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will present at SVC TechCon 2019, April 30-May 1, Long Beach, California, USA.
Mar 18, 2019 | Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary.
Feb 09, 2019 | Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.
Feb 06, 2019 | Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Jan 23, 2019 | Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company’s proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from Jan. 29-31 in San Diego, California, USA.
Jan 16, 2019 | Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.
Jan 15, 2019 | Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.
Jan 12, 2019 | Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
Jan 08, 2019 | Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
Dec 21, 2018 | Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s workshop on Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electronic Vehicles, Feb. 12-13, 2019, in Austin, Texas.
Dec 18, 2018 | Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Dec 16, 2018 | Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.
Dec 16, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming, Yunnan, China.
Nov 27, 2018 | Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.
Nov 14, 2018 | Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
Nov 07, 2018 | Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Oct 27, 2018 | Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Oct 25, 2018 | Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.
Oct 23, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her industry knowledge and expertise at Minor Metals Trade Association (MMTA) China Minor Metals Seminar on Nov. 6, in Tsim Sha Tsui East, Hong Kong, China.
Oct 22, 2018 | Indium Corporation was recognized at SMTA International 2018 in Rosemont, Ill., with two awards from the Surface Mount Technology Association (SMTA) for their contributions to the industry.
Oct 15, 2018 | Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.
Dec 19, 2017 | Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.
Dec 05, 2017 | Indium Corporation’s Donna Vareha-Walsh, Director will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on Jan. 18 in Salzburg, Austria.
Dec 03, 2017 | Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in Chengdu Qinhuang, China.
Aug 30, 2016 | Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
Aug 09, 2016 | The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.
Aug 03, 2016 | Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.
Apr 26, 2016 | Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will instruct an SMTA Webtorial from 1-2 p.m. on May 17 and 19.
Apr 22, 2016 | Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.
Apr 21, 2016 | Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.
Apr 12, 2016 | Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.