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News Releases from Indium Corporation

Read Indium Corporation company news


255 news releases added by Indium Corporation

Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(9) products in the catalog

(22) technical library articles

(255) news releases

Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich

Oct 15, 2018 | Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.

Andreas Karch.

Indium Corporation to Feature New Solder Paste for Fine Feature Printing at APEX 2018

Dec 19, 2017 | Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

Dec 05, 2017 | Indium Corporation’s Donna Vareha-Walsh, Director will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on Jan. 18 in Salzburg, Austria.

Donna Vareha-Walsh, Director.

Indium Corporation Logistics Expert Shares Indium Metal Supply and Demand at 2017 Global Minor Metals Forum in China

Dec 03, 2017 | Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in Chengdu Qinhuang, China.

Donna Vareha-Walsh.

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 30, 2016 | Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 09, 2016 | The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Aug 03, 2016 | Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 26, 2016 | Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will instruct an SMTA Webtorial from 1-2 p.m. on May 17 and 19.

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 22, 2016 | Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

Andreas Karch, Regional Technical Manager at Indium Corporation.

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 21, 2016 | Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.

Sandy-Smith is a Technical Support Engineer at Indium Corporation.

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 12, 2016 | Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.

Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting

Apr 07, 2016 | Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will present at two upcoming SMTA regional forums: SMTA Intermountain Expo & Tech Forum on April 7 in Boise, Idaho; and SMTA Long Island on April 27 in Islandia, N.Y.

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Apr 06, 2016 | Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.

Indium Corporation Names Hults as Global Accounts Manager

Mar 29, 2016 | Indium Corporation announces the promotion of Tim Hults to Global Accounts Manager.

Tim Hults, Global Accounts Manager at Indium Corporation.

Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Mar 23, 2016 | Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Indium Corporation’s New Indium10.8HF Solder Paste Technology Exhibits Best-in-Class Non-Wet Open Performance

Mar 22, 2016 | Indium Corporation's new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Indium Corporation VP of Technology to Present at SMT Hybrid Packaging

Mar 17, 2016 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.

Dr. Ning-Cheng Lee, Vice President of Technology at Indium Corporation.

Indium Corporation Receives CIRCUITS ASSEMBLY Service Excellence Award at IPC APEX 2016

Mar 17, 2016 | Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at IPC APEX Expo 2016

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Mar 17, 2016 | Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation Products "Live@APEX"

Mar 11, 2016 | Indium Corporation will be running its low-voiding solder products "Live@APEX" in partner booths throughout IPC APEX Expo 2016. "Live@APEX," a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations on the APEX show floor.

Mario Scalzo, Senior Technical Support Engineer at Indium Corporation.

Indium Corporation's Lim to Present at SEMICON China

Mar 03, 2016 | Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.

Sze Pei Lim, Semiconductor Product Manager for Asia at Indium Corporation

Indium Corporation Features 'Power-Safe' NC-SMQ®75 Die-Attach Solder Paste at SEMICON China

Feb 20, 2016 | Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.

Power-Safe NC-SMQ®75 is the world's first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications

Indium Corporation Features Indium3.2HF Pb-Free Water-Soluble Solder Paste at Productronica China

Feb 18, 2016 | Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.

Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste targeted at system-in-package (SiP) devices for the Internet-of-Things (IoT).

Indium Corporation Experts to Present at APEX 2016

Feb 16, 2016 | Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present at the IPC APEX Expo technical conference on March 13-17 in Las Vegas, Nev. Dr. Lee will give his presentation A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations at the Flux Reliability technical session at 1:30 p.m. on March 16. He will talk about a new halogen-free no-clean SnAgCu solder paste that exhibits very good SIR and SMT assembly performance, including low QFN voiding and high HIP resistance.

Indium Corporation Features Heat-Spring® for LED Manufacturing at Strategies in Light

Feb 11, 2016 | Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.

Indium Corporation’s Indium8.9HF Solder Paste Technology Solution to Avoid the Void™

Feb 11, 2016 | Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Feb 06, 2016 | Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.

Indium Corporation Expert Presents at SMTA Rocky Mountain

Jan 20, 2016 | Indium Corporation's Brandon Judd, Technical Support Engineer, will present at the Surface Mount Technology Association (SMTA) Rocky Mountain chapter meeting on Jan. 26 at the Mile High Stadium in Denver, Colo.

Brandon Judd, Technical Support Engineer at Indium Corporation.

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Jan 05, 2016 | Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Indium Corporation Features InFORMS® at NEPCON Japan

Dec 13, 2015 | Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

Indium Corporation Wins Global Technology Award for InFORMS®

Dec 01, 2015 | Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

InFORMS® high-reliability solder preforms are revolutionary in their ability to provide uniform bondline thickness.

Indium Corporation’s EZ-Pour® Gallium Trichloride Simplifies Room Temperature Processes

Nov 18, 2015 | Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.

Indium Corporation’s EZ-Pour® Gallium Trichloride Simplifies Room Temperature Processes

Nov 16, 2015 | Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.

Indium Corporation’s EZ-Pour® Gallium Trichloride.

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Nov 14, 2015 | Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Nov 12, 2015 | Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium8.9HF is specifically formulated to reduce or eliminate voiding for improved finished goods reliability. This paste is perfectly suited for a variety of applications, especially automotive assembly, due to its unique oxidation barrier technology.

Indium Corporation® Names Vareha-Walsh as Director: Metals Unit

Nov 09, 2015 | Indium Corporation announces the addition of Donna Vareha-Walsh as Director, Metals Unit. Vareha-Walsh brings extensive metals market experience from her previous roles, including Director of Global Procurement, Director of Metallurgical Procurement, Plant Controller, and Global Business Manager. She also has experience in the metals recycling and scrap/reclaim markets.

Donna Vareha-Walsh, new Director, Metals Unit at Indium Corporation.

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Oct 30, 2015 | Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation Discusses Enhanced Electronics Manufacturing Productivity and Profitability Through Materials Selection

Oct 28, 2015 | Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity and profitability.

Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF at Productronica

Oct 27, 2015 | Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation's Jensen to Share Expertise on Improving Mechanical, Electrical, and Thermal Reliability of Electronics

Oct 18, 2015 | Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla.

Indium Corporation's Jensen to Share Expertise on Improving Mechanical, Electrical, and Thermal Reliability of Electronics

Oct 15, 2015 | Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, will lead a professional development course at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26, in Orlando, Fla. Jensen's course, Improving Mechanical, Electrical, and Thermal Reliability of Electronics, provides practical knowledge that can be applied to current processes to improve the overall reliability of electronics assemblies.

Tim Jensen, Senior Product Manager for Engineered Solders at Indium Corporation.

Indium Corporation Announces New Tech Publication by SMT Expert Phil Zarrow

Oct 11, 2015 | Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting.

Indium Corporation Technologists to Speak at IMAPS 2015

Oct 05, 2015 | Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.

Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R

Sep 29, 2015 | Indium Corporation's Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.

Indium Corporation Technology Expert to Present at SMTA Puget Sound Chapter

Sep 24, 2015 | Indium Corporation's Eric Bastow, Assistant Technical Manager, will present at a meeting of the Puget Sound Chapter of the SMTA on Oct. 27 in Seattle, Wash.

Eric Bastow, Assistant Technical Manager at Indium Corporation.

Indium Corporation Expert to Present at EPE

Jul 14, 2015 | Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drives’s (EPE) 17th Conference on Power Electronics and Applications, Sept. 8-10 in Geneva, Switzerland.

Indium Corporation and IMAPS Empire Chapter to Host "Advances in Semiconductor Packaging" Workshop in September

Jun 18, 2015 | Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.

Indium Corporation Products Running “Live @ APEX”

Feb 18, 2015 | Indium Corporation products will be featured in 19 industry partner booths throughout the IPC APEX Expo in San Diego, Calif., as part of Indium Corporation’s Live @ APEX program.

Indium Corporation Adds to Rapidly-Growing SMTA-Certified Engineering Team

Jan 22, 2015 | Indium Corporation announces that several company technologists have earned their designation as SMTA-Certified Process Engineers, further expanding the largest SMTA-certified engineering team in the industry.

Indium Corporation VP of Technology to Present SMTA Webtorial

Jan 20, 2015 | Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.

Dr. Ning-Cheng Lee, vice president of technology at Indium Corporation.

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