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News Releases from Indium Corporation

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294 news releases added by Indium Corporation

Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(10) products in the catalog

(25) technical library articles

(294) news releases

Indium Corporation Experts to Present at IMAPS

Sep 10, 2020 | Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.

Indium Corporation Announces Spanish-Language Voiding Workshop Webinar

Sep 06, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).

Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar

Aug 28, 2020 | Indium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar with SEMI at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) on Thursday, Sept. 17.

Indium Corporation Expert to Host Electronic Assembly Reliability Webinar

Aug 22, 2020 | Indium Corporation's Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will host an InSIDER Series webinar focused on solder paste attributes and their impact on increased product service life reliability requirements. The webinar will be presented on Webex, Wednesday, Sept. 2 at 9 a.m. Eastern Time (2 p.m. British Time/9 p.m. Malaysia Time).

Indium Corporation to Host PCB and Component Defects Webinar

Aug 22, 2020 | Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).

Indium Corporation Announces Chinese Webinar Series

Aug 07, 2020 | Indium Corporation now offers Chinese-language webinars as part of its InSIDER Series program. The first Chinese webinar of the series was recently hosted by Dr. Ning-Cheng Lee, Vice President of Technology, who discussed defect elimination in thermal management.

Indium Corporation and KYZEN Experts to Host Cleaning No-Cleans Webinar

Jul 22, 2020 | Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).

Indium Corporation Expert to Host 5G Connectivity Webinar

Jul 22, 2020 | Indium Corporation's Jenny Gallery, Product Specialist, will host a webinar focused on gold-based thermal solutions for 5G connectivity. There will be two sessions on Wednesday, Aug. 5, during International Microwave Symposium's (IMS) virtual conference. The first session will be held at 8 a.m. Eastern Time (1 p.m. British Time/8 p.m. Malaysia Time), with the second at 2 p.m. Eastern Time (7 p.m. British Time/2 a.m., Aug. 6, Malaysia Time).

Indium Corporation Releases Report on Indium, Gallium Availability

Jul 22, 2020 | Indium Corporation has released a report on the worldwide availability of indium and gallium metal.

Indium Corporation Receives EM World's Innovation Award

Jul 22, 2020 | Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.

Indium Corporation's Daisy Huang, Sales Manager, Northern and Eastern China, (right) accepts the award.

Indium Corporation's Dr. Lee Co-Authors Book on Lead-Free Assembly

Jul 14, 2020 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.

Indium Corporation Announces Spanish-Language Low-Temperature Solder Webinar

Jul 07, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an InSIDER Series webinar focused on the company's innovative low-temperature solder offering on July 21 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).

Indium Corporation Expert to Host Power Electronics Webinar

Jun 18, 2020 | Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.

Indium Corporation Announces Low-Temp Solder Webinars

May 12, 2020 | Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.

Indium Corporation’s Vareha-Walsh to Share Insights at World Congress of Smart Materials 2020

Jan 10, 2020 | Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress of Smart Materials 2020, March 11-13, 2020, in Barcelona, Spain.

Indium Corporation’s Industry Partners to Feature ‘Live@Productronica’ Demonstrations

Nov 12, 2019 | Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program.

Indium Corporation Launches IndiTri™—High-Purity Indium Trichloride

Apr 23, 2019 | IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.

Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities

Apr 17, 2019 | Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and China. The company’s headquarters in Clinton, NY, USA has also achieved IATF 16949 certification.

Indium Corporation Features New InFORMS® Solution for Die-Level Bonding at PCIM 2019

Apr 15, 2019 | Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.

Indium Corporation’s Vareha-Walsh to Present at SVC TechCon

Apr 14, 2019 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will present at SVC TechCon 2019, April 30-May 1, Long Beach, California, USA.

Donna Vareha-Walsh.

Indium Corporation Celebrates 85 Years of Technology Innovation and Growth

Mar 18, 2019 | Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary.

Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019

Feb 09, 2019 | Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.

Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste

Feb 06, 2019 | Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.

Indium Corporation Actively Engaging Attendees on the 2019 IPC APEX Expo Show Floor

Jan 23, 2019 | Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company’s proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from Jan. 29-31 in San Diego, California, USA.

Indium Corporation Names Silver Quill Award Winners

Jan 16, 2019 | Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.

Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award

Jan 15, 2019 | Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.

Indium Corporation Experts to Present at Pan Pacific Microelectronics 2019

Jan 12, 2019 | Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.

Jonas Sjoberg, Associate Director – Global Tech Services.

Indium Corporation Experts to Present at IPC APEX Expo

Jan 08, 2019 | Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.

Indium Corporation’s Mackie to Speak at TechSearch International Workshop

Dec 21, 2018 | Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s workshop on Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electronic Vehicles, Feb. 12-13, 2019, in Austin, Texas.

Andy Mackie, PhD, MSc, Senior Product Manager.

Indium Corporation Expert to Present at ELEXCON 2018

Dec 18, 2018 | Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.

Indium Corporation Features Gold Alloy Solder Preforms at SPIE Photonics West

Dec 16, 2018 | Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.

Gold Alloy Solder Preforms.

Indium Corporation’s Vareha-Walsh Presents at Global Minor Metals Trade Association (MMTA) Event in China

Dec 16, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming, Yunnan, China.

Donna Vareha-Walsh at the 2018 Global Minor Metals Forum.

Indium Corporation’s Indium10.1HF Solder Paste Wins Mexico Technology Award

Nov 27, 2018 | Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.

Indium Corporation earned the Mexico Technology Award.

Indium Corporation to Feature Indium8.9HF Solder Paste at IPC APEX EXPO 2019

Nov 14, 2018 | Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.

Indium Corporation VP of Technology to Lead Professional Development Course at EPTC 2018

Nov 07, 2018 | Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.

Vice President of Technology, Dr. Ning-Cheng Lee.

Indium Corporation Experts Honored With Best Paper Award at IMPACT 2018

Oct 27, 2018 | Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.

Dr. Ning-Cheng Lee, Vice President .

Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop

Oct 25, 2018 | Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.

Indium Corporation’s Vareha-Walsh to Present at Minor Metals Trade Association (MMTA) Event in China

Oct 23, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her industry knowledge and expertise at Minor Metals Trade Association (MMTA) China Minor Metals Seminar on Nov. 6, in Tsim Sha Tsui East, Hong Kong, China.

Donna Vareha-Walsh.

Indium Corporation Earns Awards at SMTAi 2018

Oct 22, 2018 | Indium Corporation was recognized at SMTA International 2018 in Rosemont, Ill., with two awards from the Surface Mount Technology Association (SMTA) for their contributions to the industry.

Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich

Oct 15, 2018 | Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.

Andreas Karch.

Indium Corporation to Feature New Solder Paste for Fine Feature Printing at APEX 2018

Dec 19, 2017 | Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

Dec 05, 2017 | Indium Corporation’s Donna Vareha-Walsh, Director will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on Jan. 18 in Salzburg, Austria.

Donna Vareha-Walsh, Director.

Indium Corporation Logistics Expert Shares Indium Metal Supply and Demand at 2017 Global Minor Metals Forum in China

Dec 03, 2017 | Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in Chengdu Qinhuang, China.

Donna Vareha-Walsh.

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 30, 2016 | Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 09, 2016 | The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Aug 03, 2016 | Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 26, 2016 | Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will instruct an SMTA Webtorial from 1-2 p.m. on May 17 and 19.

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 22, 2016 | Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

Andreas Karch, Regional Technical Manager at Indium Corporation.

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 21, 2016 | Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.

Sandy-Smith is a Technical Support Engineer at Indium Corporation.

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 12, 2016 | Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.

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