News Releases from Indium Corporation
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422 news releases added by Indium Corporation
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Indium Corporation Announces Spanish-Language Printing Webinar
Jul 27, 2021 | Indium Corporation's Iván Castellanos, technical services manager for Latin America, will host two sessions of an InSIDER Series webinar on the basics of reflow profiling. The first session will be on Tuesday, Aug. 17 at 3 p.m. Central/4 p.m. Eastern, followed by the second session on Thursday, Aug. 19 at 3 p.m. Central/4 p.m. Eastern.
Elements of Indium by Indium Corporation: Cold Welding
Jul 22, 2021 | At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series--an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.
Indium Corporation Expert to Host iNEMI Roadmap Webinar
Jul 19, 2021 | Indium Corporation's Dr. Ron Lasky, senior technologist, will host a webinar comparing past iNEMI roadmap predictions with their outcomes on Thursday, Aug. 10 at 7 a.m. San Francisco/10 a.m. New York/3 p.m. London as part of the company's free webinar program, the InSIDER Series.
Indium Corporation Introduces New Hand Soldering, Rework Flux
Jul 19, 2021 | Indium Corporation has released TACFlux®571HF, a new no-clean, halogen-free flux formulated for both hand soldering and rework.
Indium Corporation Expert to Host Weibull Analysis Webinar
Jul 02, 2021 | Indium Corporation's Dr. Ron Lasky, senior technologist, will host a webinar on the fundamentals of Weibull distribution and analysis on Thursday, July 29 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London on Indium Corporation's webinar program, the InSIDER Series.
Indium Corporation to Feature High-Reliability Products at CEIA Wuhan
Jun 17, 2021 | Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Indium Corporation Experts to Present at ICEHET
May 18, 2021 | Two of Indium Corporation's experts will present in the virtual International Conference for Electronics Hardware Enabling Technologies(ICEHET) virtual conference, hosted by SMTA Toronto, June 2-3.
Indium Corporation Expert to Present at ICEP
Apr 29, 2021 | Indium Corporation's Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May 12-14.
Elements of Indium by Indium Corporation: Liquid Gallium-Indium
Apr 15, 2021 | At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series--an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.
Indium Corporation Experts to Present at IMAPS Device Packaging Virtual Conference
Mar 30, 2021 | Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Indium Corporation to Feature Low-Temp Alloy at Productronica China
Mar 06, 2021 | Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 inShanghai, China.
Indium Corporation to Feature New Flux-Cored Wire at IPC APEX Expo
Feb 25, 2021 | Indium Corporation will feature its uniquely formulated flux-cored wire during the virtual IPC APEX Expo, to be held March 8-12.
Indium Corporation Introduces New Fast-Wetting, Low-Spatter Flux-Cored Wire for Robotic and Laser Soldering
Jan 21, 2021 | Indium Corporation announces that it is now offering CW-232,a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance.
Indium Corporation Announces Ultrafine Dispensing Webinar
Jan 17, 2021 | Indium Corporation's Kenneth Thum, Senior Technical Support Engineer, will host an InSIDER Serieswebinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at 8 p.m. Eastern Time/Wednesday, Jan. 27 at 9 a.m. Singapore Time.
Indium Corporation Expert to Present for IEEE EPS Webinar Series
Dec 10, 2020 | Indium Corporation's Dr. Hong Wen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series at 9 a.m. Malaysia Time, Wednesday, Dec. 16 (8 p.m. Eastern Time, Tuesday, Dec. 15).
Indium Corporation's Proven Jetting Paste Recommended by NSWAutomation
Dec 03, 2020 | Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.
Indium Corporation Expert to Present IMAPS Webinar
Dec 01, 2020 | Indium Corporation's Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, December 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
Indium Corporation Expert to Participate in Miniaturization Round table
Nov 24, 2020 | Indium Corporation's Adam Murling, Technical Support Engineer, will participate in a virtual miniaturization round table hosted by BarTron on Thursday, Dec. 10 at 10 a.m. Eastern Time (3 p.m. British Time/11 p.m. Malaysia Time).
Indium Corporation Expert to Participate in Low-Temperature Solders Debate
Nov 23, 2020 | Indium Corporation's Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday, December 8 at 10:30 a.m. Eastern Time (3:30 p.m. British Time/11:30 p.m. Malaysia Time).
Indium Corporation Expert to Participate in Online Thermal Conference
Nov 09, 2020 | Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS'sonline thermal management conference from Nov. 25-26.
Indium Corporation Strategic Partnership with RENEX Group
Nov 03, 2020 | Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in Poland.
Indium Corporation Expert Presented atHigh-Density Assemblies Webinar
Oct 31, 2020 | Indium Corporation's Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, participated in a soldering-focused webinar hosted by MELSS on Thursday, October 15.
Indium Corporation's Durafuse™LT EarnsMexico Technology Award
Oct 31, 2020 | Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system.
Indium Corporation Receives Electronics Maker's Best of Industry Award
Oct 29, 2020 | Indium Corporation earned Electronics Maker's Best of Industry Award for 'Excellence in Electronics Assembly Materials' on Thursday, October 15 during a virtual ceremony.
Indium Corporation Expert to Present at EPP Innovations FORUM Germany
Oct 14, 2020 | Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the virtualEPP InnovationsFORUM Germanyon Oct. 28 at 12:05p.m.Central European Time.
Indium Corporation Announces Low-Temp Solder Seminar at LEAP Expo
Oct 14, 2020 | Indium Corporation'sAnson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China.
Indium Corporation Expert to Host High-Density Assemblies Webinar
Oct 04, 2020 | Indium Corporation's Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, will host an InSIDER Series webinar regarding the implementation of high-density assemblies in electronic products on Tuesday, October 13 at 8 a.m. New York Time (1 p.m. British Time/8 p.m. Malaysia Time).
Indium Corporation AnnouncesAutomotive Electronics Assembly and Packaging Webinar
Oct 04, 2020 | Indium Corporation'sAndy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020at 9:30 a.m.Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13/2:30 a.m.British Time on Oct. 13).
Indium Corporation Experts to Present at IMAPS
Sep 10, 2020 | Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.
Indium Corporation Announces Spanish-Language Voiding Workshop Webinar
Sep 06, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar
Aug 28, 2020 | Indium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar with SEMI at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) on Thursday, Sept. 17.
Indium Corporation Expert to Host Electronic Assembly Reliability Webinar
Aug 22, 2020 | Indium Corporation's Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will host an InSIDER Series webinar focused on solder paste attributes and their impact on increased product service life reliability requirements. The webinar will be presented on Webex, Wednesday, Sept. 2 at 9 a.m. Eastern Time (2 p.m. British Time/9 p.m. Malaysia Time).
Indium Corporation to Host PCB and Component Defects Webinar
Aug 22, 2020 | Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Indium Corporation Announces Chinese Webinar Series
Aug 07, 2020 | Indium Corporation now offers Chinese-language webinars as part of its InSIDER Series program. The first Chinese webinar of the series was recently hosted by Dr. Ning-Cheng Lee, Vice President of Technology, who discussed defect elimination in thermal management.
Indium Corporation and KYZEN Experts to Host Cleaning No-Cleans Webinar
Jul 22, 2020 | Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).
Indium Corporation Expert to Host 5G Connectivity Webinar
Jul 22, 2020 | Indium Corporation's Jenny Gallery, Product Specialist, will host a webinar focused on gold-based thermal solutions for 5G connectivity. There will be two sessions on Wednesday, Aug. 5, during International Microwave Symposium's (IMS) virtual conference. The first session will be held at 8 a.m. Eastern Time (1 p.m. British Time/8 p.m. Malaysia Time), with the second at 2 p.m. Eastern Time (7 p.m. British Time/2 a.m., Aug. 6, Malaysia Time).
Indium Corporation Releases Report on Indium, Gallium Availability
Jul 22, 2020 | Indium Corporation has released a report on the worldwide availability of indium and gallium metal.
Indium Corporation Receives EM World's Innovation Award
Jul 22, 2020 | Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.
Indium Corporation's Dr. Lee Co-Authors Book on Lead-Free Assembly
Jul 14, 2020 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.
Indium Corporation Announces Spanish-Language Low-Temperature Solder Webinar
Jul 07, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an InSIDER Series webinar focused on the company's innovative low-temperature solder offering on July 21 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Indium Corporation Expert to Host Power Electronics Webinar
Jun 18, 2020 | Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.
Indium Corporation Announces Low-Temp Solder Webinars
May 12, 2020 | Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.
Indium Corporation’s Vareha-Walsh to Share Insights at World Congress of Smart Materials 2020
Jan 10, 2020 | Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress of Smart Materials 2020, March 11-13, 2020, in Barcelona, Spain.
Indium Corporation’s Industry Partners to Feature ‘Live@Productronica’ Demonstrations
Nov 12, 2019 | Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program.
Indium Corporation Launches IndiTri™—High-Purity Indium Trichloride
Apr 23, 2019 | IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.
Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities
Apr 17, 2019 | Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and China. The company’s headquarters in Clinton, NY, USA has also achieved IATF 16949 certification.
Indium Corporation Features New InFORMS® Solution for Die-Level Bonding at PCIM 2019
Apr 15, 2019 | Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Indium Corporation’s Vareha-Walsh to Present at SVC TechCon
Apr 14, 2019 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will present at SVC TechCon 2019, April 30-May 1, Long Beach, California, USA.
Indium Corporation Celebrates 85 Years of Technology Innovation and Growth
Mar 18, 2019 | Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary.
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019
Feb 09, 2019 | Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.
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