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News Releases from Heraeus

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31 news releases added by Heraeus

Company Information:

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer

  • Phone 610 825 6050
  • Fax 610 825 7061

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Company Postings:

(1) product in the catalog

(7) technical library articles

(31) news releases

Heraeus Electronics to Debut New Silver Sinter Paste for Module Attach Applications at PCIM Europe

May 27, 2024 | Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe. The event will take place June 11-13, 2024 in Nuremberg, Germany. This latest advancement aims to revolutionize thermal performance in electronic manufacturing, addressing industry challenges head-on.

Heraeus Electronics, MacDermid Alpha Electronics Solutions and Henkel Win Patent Infringement Lawsuit Against Senju Group

Apr 08, 2024 | Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe GmbH and Senju Manufacturing Europe S.R.O.) as pronounced by the District Court Frankfurt on April 3, 2024. The 1st instance judgment confirmed Senju's infringement of the patent EP 1 617 968 B1 in Germany by the M794 solder alloy material.

Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics

Apr 03, 2024 | Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking developments in high-efficiency power electronics, particularly focusing on the capabilities of GaN chips to revolutionize the industry with higher efficiency, power density, and smaller sizes.

Don't Miss Heraeus Electronics' Award-Winning Innolot® 2.0 Solder Paste at APEX

Mar 18, 2024 | Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.

Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology

Mar 11, 2024 | Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

Heraeus Electronics Thick Film Expands Its Portfolio through Acquisition of PriElex Electronic Inks from Kayaku Advanced Materials

Feb 05, 2024 | Heraeus Electronics is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc. The acquisition, effective January 31, 2024, strengthens Heraeus Electronics' Thick Film business and expands its portfolio of offerings for the electronics materials industry.

Heraeus Electronics Wins 2023 GLOBAL Technology Award for Solder Alloy Innovation

Nov 20, 2023 | Heraeus Electronics is proud to announce its receipt of the prestigious 2023 GLOBAL Technology Award in the category of Solder Paste. The award highlights the contribution made by Heraeus Electronics' Microbond® SMT660 Innolot® 2.0 solder paste. The award was announced during an award ceremony that took place at productronica in Munich on Nov. 14, 2023.

Heraeus Electronics Honored by 2023 Mexico Technology Awards for New Microbond® SMT660 Series

Oct 30, 2023 | Heraeus Electronics is pleased to announce that it has been honored with a 2023 Mexico Technology Award in the category of Solder Paste – No-clean. The award recognizes Heraeus Electronics' contribution to the automotive industry with its Microbond® SMT660 Innolot® 2.0 Solder Paste. The award was announced during a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.

Heraeus Electronics Honored as Best Material Supplier 2022 by STMicroelectronics Bouskoura Site

Sep 13, 2023 | Heraeus Electronics has been awarded Best Material Supplier of 2022 by STMicroelectronics' Bouskoura test and assembly site. The award was presented during the annual Supplier Day held on July 20, 2023 at the site in Morocco.

Heraeus Electronics to Present Pastes for the Next Era of Mobility at SMTA International 2023

Sep 11, 2023 | Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.

Driving E-Mobility with Copper Sinter Innovations: Heraeus Electronics Partner of Public Funded Joint Project "KuSIn"

Sep 04, 2023 | Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project "KuSIn - Copper sinter processes using induction heating for electromobility applications", funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).

Heraeus Electronics Receives Bosch Global Supplier Award

Aug 07, 2023 | Heraeus Electronics has been honored by Bosch, a leading global supplier of technology and services, with the renowned Bosch Global Supplier Award in the category "Raw Material and Components" for its exceptional performance.

Celebrating a Decade of Impact: Heraeus Electronics Marks 10 Years of Success in Romania

Jul 31, 2023 | Heraeus Electronics proudly commemorates its 10th anniversary in Romania, celebrating a decade of passion, innovation, and remarkable achievements. The official 10-Year Celebration took place on July 7, 2023, at the Heraeus Romanian facility in Timisoara. The event brought together more than 650 participants, including Heraeus employees and their families, distinguished guests, local officials, academics, diplomats, and members of the press.

Heraeus Introduces a Disruptive New Product: PTC4900 Series Self-Regulating Heater Inks – the Ultimate Customizable Solution for PTC Heater Needs

Jul 19, 2023 | Heraeus Electronics introduces the PTC4900 Series Self-Regulating Heater Inks, a breakthrough in heater technology. These customizable PTC (Positive Thermal Coefficient) inks offer enhanced performance, expanded operating temperatures, and unparalleled customization options. Designed for precise temperature control, they are suitable for various applications, including EV battery heaters, ADAS heaters, flooring heaters and cabin comfort heaters.

Green Transformation: Heraeus Electronics Participates in EU-Project "All2GaN" for Power Electronics

Jul 10, 2023 | Heraeus Electronics is proud to announce its participation in the EU-funded research project "ALL2GaN" (Affordable smart GaN IC solutions for greener applications). This collaborative project, led by Infineon Austria, brings together 45 partners from twelve countries with a total budget of approximately 60 million euros. The aim of ALL2GaN is to harness the energy-saving potential of gallium nitride (GaN) power semiconductors, making them easily integrable into various applications to enhance energy efficiency and reduce emissions.

Heraeus Electronics to introduce new advanced solutions to further elevate device performance at SEMICON China 2023

Jul 03, 2023 | Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology at PCIM Europe Exhibition

May 30, 2023 | Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the development of their inorganic potting compound, CemPack®, for encapsulation of power modules.

Heraeus Electronics Develops New Production Friendly Flexible End Termination Ink

Apr 03, 2023 | Heraeus Electronics is pleased to announce the development of a production friendly, flexible passive component termination ink. ET2010 Flexible End Termination Ink is a first of its kind material in the market utilizing advanced polymer technology. When compared to current thermoset, epoxy-based inks in the market, Heraeus' solution offers easier shipping, storage, and handling at room temperatures.

A New Era of Mobility: Heraeus Electronics Launches New Innolot® 2.0 Solder Paste

Feb 27, 2023 | Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability, high performance solder paste provides a competitive TCO offering. Based on Heraeus Electronics' proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs.

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Jan 30, 2023 | For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Jan 23, 2023 | Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus to Release New Solder Paste for Automotive SMT Applications at APEX 2023

Dec 21, 2022 | Heraeus Electronics will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase three innovative products designed to meet current and future SMT challenges. New solutions are needed to meet the increasing demands for miniaturization, reliability and TCO challenges.

Heraeus marks the second anniversary of its Center of Excellence for Advanced Packaging in Singapore

Dec 07, 2022 | Heraeus Electronics celebrated the 2nd anniversary of its Center of Excellence for Advanced Packaging in Singapore with a customer event.

Heraeus Webinar shares new insights in LED packaging

Jun 16, 2022 | Heraeus Electronics today announced that it will hold a free WelcoTM LED Solder Paste Webinar on Thursday, June 9, 2022 at 3 a.m. EDT. The new webinar is entitled, "Enabling Mini and Micro LED using Heraeus Electronics LED series solder paste."

Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe

May 18, 2022 | Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.

Heraeus Electronics to Present "Al2O3, ZTA, AMB and What's Next?" at PCIM Europe

May 18, 2022 | Heraeus Electronics today announced that Bastian Schlüter, Global Product Manager Metal Ceramic Substrates, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "Al2O3, ZTA, AMB and What's Next?" is scheduled to take place May 11, 2022 at 12:50 p.m.

Heraeus Electronics Announces Global Launch of Condura®.ultra Ag Si3N4 free AMB Substrate at PCIM Europe

May 18, 2022 | Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.

Heraeus Electronics to Present during the E-Mobility Forum at PCIM Europe

May 05, 2022 | Heraeus Electronics today announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach and Sinter Products, Heraeus Electronics, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "How Near is Copper Sintering?" is scheduled to take place May 10, 2022 at 11:20 a.m.

More power for European electromobility - Heraeus and Danfoss start cooperation for production of state-of-the-art control modules for electric motors / Heraeus Electronics opens new production line i

Apr 28, 2022 | In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.

Heraeus Electronics Exhibits at PCIM Europe May 10-12th

Apr 13, 2022 | Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.

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