News Releases from Henkel Electronic Materials
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61 news releases added by Henkel Electronic Materials
Company Information:
Henkel Launches Breakthrough Self-filleting Die Attach Technology
Dec 06, 2008 | Further advancing the capabilities of modern die attach technology, Henkel has developed and made commercially available a line of new Ablestik� brand die attach materials known as self-filleting die attach. The new class of die attach products offers all of the benefits of traditional die attach pastes, but takes the adhesive technology further by incorporating a self-filleting mechanism, making it a viable and much less costly alternative to die attach films.
Henkel's New Wafer Backside Coating� Portfolio Revolutionizes Die Attach Processes
Aug 01, 2008 | With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.
Henkel Names New Electronics utive Team
Jul 24, 2008 | Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel today named the utive team that will lead its electronics group as it continues to advance materials technology and become the premiere materials partner for electronics firms worldwide.
Henkel Signs Distribution Agreement with South African Firm, PEM Technologies
Jul 08, 2008 | As the company continues to expand in both established and emerging electronics manufacturing regions, the electronics group of Henkel today announced a new partnership to extend its presence in South Africa. The materials leader has signed on PEM Technologies to represent its line of Loctite� brand electronics adhesives in the growing South African region.
Henkel and Leading Shanghai-Region Academia form Joint Electronics Research and Failure Analysis Center
Jul 01, 2008 | Committed to promoting electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.
Henkel named to "World�s Most Ethical Companies" list
Jun 12, 2008 | The socially responsible corporate management practices of Henkel have once again been recognized by an independent body. Henkel has been named to the �World�s Most Ethical Companies� list. John Knudson, President of Henkel of America, and Brad Casper, President and Chief Executive Officer of The Dial Corporation, accepted this honor at an evening awards dinner held yesterday in New York.
Henkel Launches New Fast Cure Silicone Ideal for Added Stability within Harsh Environments
Apr 22, 2008 | To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.
Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations
Apr 17, 2008 | In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.
Henkel's Materials Innovations Honored at APEX
Apr 10, 2008 | Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.
Henkel Introduces Dispensable Phase Change Thermal Interface Material
Feb 28, 2008 | To address the emerging requirements of today�s heat generating devices, Henkel has launched its latest thermal product, PowerstrateXtreme� Dispensable (PSX-D). As a paste medium, Henkel�s PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility.
Loctite Receives Quality Improvement Award
Mar 13, 2002 | Loctite Corp. has been named a recipient of Intel Corp.'s (Chandler, AZ) 2001 Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance by suppliers providing products and services deemed essential to Intel's success. The company was recognized for its efforts in supplying Intel with die attach adhesives and underfill materials. All SCQI award winners will be honored at a celebration in Burlingame, CA on March 13, 2002.
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