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News Releases from Finetech

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88 news releases added by Finetech

Company Information:

Finetech

Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.

Gilbert, Arizona, USA

Manufacturer

  • Phone +1 480 893-1630
  • Fax +1 480 893-1632

Finetech website

Company Postings:

(10) products in the catalog

(88) news releases

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Jan 14, 2019 | Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).

SMART DESOLDER 01.

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Apr 07, 2016 | Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 27, 2013 | Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.

Martijn Process Shuttle Streamlines and Simplifies Rework

Finetech Unveils High Force ACF Bonder

Nov 08, 2013 | Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Al Cabral Joins Finetech as Regional Sales Manager

May 28, 2013 | Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.

Donated Finetech Die Bonder Installed at Pennsylvania State University

Mar 11, 2013 | A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 16, 2013 | Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Jan 04, 2013 | Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Oct 03, 2012 | Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo

 FINEPLACER® core rework system

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 26, 2012 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,

Mini-Oven Reball/PreBump Unit

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Sep 10, 2012 | MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Sep 05, 2012 | Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Pennsylvania State University Wins Finetech Die Bonder Donation

Aug 29, 2012 | Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.

MARTIN’s EXPERT 04.6IXM: Reworking Heavy Substrates

Jun 04, 2012 | MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.

 EXPERT 04.6IXM

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Upper Midwest Expo and Tech Forum

May 31, 2012 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum

Mini-Oven Reball/Solder Bumping Unit

Rochester Institute of Technology Partners with MARTIN to Provide Rework Training & Research

May 15, 2012 | Rochester Institute of Technology has partnered with equipment supplier MARTIN to utilize a MARTIN Expert 10.6 Rework Station and Mini-Oven unit in its Center for Electronics Manufacturing and Assembly (CEMA)

MIRTEC RECEIVES PRESTIGIOUS EM ASIA INNOVATION AWARD FOR ITS TECHNOLOGICALY ADVANCED MV-9 3D AOI SERIES

Apr 26, 2012 | “The Global Leader in Inspection Technology”, announces that it has been awarded the 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its revolutionary MV-9 3D AOI Series.

 MV-9 3D AOI SERIES

Finetech Shows Support for University Research

Feb 07, 2012 | Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® core rework system at the 2012 IPC APEX Expo

Jan 24, 2012 | Finetech will highlight the FINEPLACER® core rework system in Booth #3020 at the upcoming IPC APEX Expo,.

The FINEPLACER® core is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.

Finetech Wins Respected Global Technology Award for Its FINEPLACER® matrix ma Bonder

Nov 20, 2011 | Finetech has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma.

FINEPLACER® matrix ma - Semi-Automatic Bonder

Finetech Opens Cleanroom in Berlin

Sep 14, 2011 | Finetech announces that comprehensive construction measures to remodel and expand the development and manufacturing facilities at Berlin headquarters have been completed.

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Sep 12, 2011 | FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging.

Innovations for FINEPLACER® lambda to be highlighted at Productronica 2011

Sep 06, 2011 | At Productronica 2011, Finetech will present a number of smart improvements and new options for the FINEPLACER® lambda.

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging.

FINEPLACER® Micro Assembly Highlights at Productronica 2011

Aug 30, 2011 | At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.

Fully-automated Sub-micron Bonder FINEPLACER® femto

Professional Solutions for Hot Air SMD Rework

Aug 24, 2011 | From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

The FINEPLACER® core is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.

Finetech Hires Norm Faucher as Applications Engineer

Aug 22, 2011 | Finetech has appointed Norm Faucher to the position of Applications Engineer effective immediately. A veteran in the electronics industry, Norm brings many years of SMT soldering expertise and customer support experience.

Norm Faucher, Finetech’s new Applications Engineer

Finetech Sells 12 Bonding Systems to University Labs to Advance Research

Jun 01, 2011 | Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging.

8th Finetech International User Meeting

May 19, 2011 | On September 29, 2011, Finetech will hold the 8th International User Meeting “Micro Assembly” in Berlin. This series of events aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.

The meeting will be conclude with a practical part in which the participants will be introduced to the latest FINEPLACER® bonding solutions and have the chance to get a hands-on impression.

Finetech to Exhibit at NEPCON China 2011

Apr 20, 2011 | Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

The FINEPLACER® core plus is a compact yet versatile rework system that offers a level of professionalism that exceeds its attractive price.

FINETECH to Showcase FINEPLACER® core rework system at IPC APEX EXPO 2011

Mar 11, 2011 | FINETECH will highlight the FINEPLACER® core rework system in Booth #1940 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

The FINEPLACER® core represents a compact, yet versatile hot-gas rework system withs a level of professionalism that exceeds its attractive price.

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Feb 17, 2011 | MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

BGA Reball/Pre-Bump Unit

FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Feb 14, 2011 | FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

The FINEPLACER® Lambda sub-micron bonder is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 micron).

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Jan 05, 2011 | FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

FINEPLACER® Lambda, Flip Chip Bonder.

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Nov 18, 2010 | MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Prebump/Reball 03.1,  Stand Alone QFN Solder Bumping and BGA Reball Unit.

Finetech to Highlight Compact Rework System FINEPLACER® core at the SMTA Penang Vendor Show

Nov 08, 2010 | Finetech will highlight the FINEPLACER® core rework system at the upcoming SMTA Penang Vendor Show, Table 8, on November 19, 2010 at the Eastin Hotel in Penang, Malaysia.

FINEPLACER® core rework system.

FINETECH/MARTIN to Host SMTA Boston Chapter Meeting

Oct 06, 2010 | FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Oct 04, 2010 | FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

FINEPLACER® Lambda

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Oct 04, 2010 | MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Prebump/Reball 03.1,  Stand Alone QFN Solder Bumping and BGA Reball Unit.

Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Oct 01, 2010 | Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

FINEPLACER® core rework system.

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Sep 15, 2010 | MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Standalone QFN Solder Bumping and BGA Reball Unit

Finetech to Highlight Compact Rework System FINEPLACER® core at GEM Expo 2010

Sep 08, 2010 | Finetech will highlight the new FINEPLACER® core rework system in distributor SMAtech Brazil‘s booth #317 at the upcoming GEM Expo 2010, scheduled to take place October 5-7, 2010 at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil.

FINEPLACER® core rework system.

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Jun 30, 2010 | MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

MARTIN Standalone BGA Reball and QFN Solder Bumping Unit.

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Jun 23, 2010 | FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

FINEPLACER® Lambda, Sub-Micron Bonder

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest

May 29, 2010 | MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Reball/Prebump 03.1,  Standalone BGA Reball and QFN Solder Bumping Unit.

FINETECH to Exhibit at ECTC 2010

May 24, 2010 | FINETECH will exhibit in booth 403 at the Technology Corner of the Electronic Components and Technology Conference (ECTC), scheduled to take place June 2-3, 2010 at the Paris Las Vegas Hotel in Las Vegas.

FINEPLACER® Femto, a fully automated, sub-micron placement bonding platform.

MARTIN’s Expert 10.6XL Wins a 2010 VISION Award

Apr 11, 2010 | MARTIN, a FINETECH company, announces that it has been awarded a 2010 SMT VISION Award in the category of Rework and Repair for its Expert 10.6XL Rework System. The award was presented to the company during a Monday, April 5, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2010.

Expert 10.6XL Rework System

ProWorks to Exhibit at IPC/APEX 2010

Mar 27, 2010 | POMONA, CA - ProWorks, a division of Everett Charles Technologies, will demonstrate its new productivity modules in the Everett Charles Technologies booth, #1782, as well as in the ScanCAD booth, #1447, at the upcoming IPC/APEX conference and exhibition.

MARTIN to Introduce Expert 10.6XL Rework System for Large PCBs at APEX 2010

Mar 27, 2010 | MARTIN, a FINETECH company, will demonstrate the new Expert 10.6XL Rework System in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

Expert 10.6XL Rework System

FINETECH to Debut Core Rework System at APEX 2010

Mar 24, 2010 | FINETECH will debut the new FINEPLACER Core rework system in booth #2329 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

FINEPLACER Core rework system

MARTIN to Demonstrate Compact, Stand-alone BGA Reball Unit at APEX 2010

Mar 24, 2010 | MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

Reball 03.1 compact, stand-alone BGA reball unit.

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