News Releases from Nihon Superior Co., Ltd.
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163 news releases added by Nihon Superior Co., Ltd.
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Nihon Superior to Showcase SN100C Lead-free Solder Alloy at Productronica
Oct 08, 2013 | Nihon Superior Co. Ltd. will exhibit in Hall A4, Stand 451 with Balver Zinn Josef Jost GmbH & Co. KG at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Nihon Superior’s Keith Sweatman to Introduce Novel Lead-Free Alloy for Elevated Temperature Service at SMTA International
Sep 17, 2013 | Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.
Nihon Superior to Address Soldering Challenges at NEPCON South China
Jul 29, 2013 | Nihon Superior Co. Ltd will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.
SMART Group Invites Keith Sweatman to Present at the SMART Group European Conference
Jun 20, 2013 | Nihon Superior Co., Ltd., announces that Keith Sweatman was invited to speak at the SMART Group European Conference on behalf of its UK distributor DKL Metals Ltd.
Nihon Superior Congratulates FCT Assembly and Krayden, Inc. on Milestone Anniversaries
Mar 13, 2013 | Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, congratulates its licensee FCT Assembly (www.fctassembly.com) on its 10-year milestone anniversary being celebrated this year.
Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste
Feb 20, 2013 | Nihon Superior Co., Ltd. announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste.
OK International has announced that its Metcal brand is the premier sponsor of the second annual IPC APEX EXPO® Hand Soldering Competition and IPC World Championship, scheduled to take place February
Jan 18, 2013 | Nihon Superior Co. Ltd., will present the paper titled “Grain Refinement for Improved Lead-Free Solder Joint Reliability” at the upcoming IPC APEX EXPO
Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO
Jan 16, 2013 | Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.
Nihon Superior Scores Its 20th Industry Award with the SN100C P810 D4 Solder Paste
Oct 17, 2012 | Nihon Superior Co., Ltd. announces that it was awarded a 2012 Global Technology Award in the category of Materials – Solder Paste for its SN100C P810 D4 No-Clean Lead-Free Solder Paste.
Nihon Superior’s Keith Sweatman to Present at SMTA International
Sep 17, 2012 | Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Nihon Superior to Introduce Ultra Low Voiding Solder Paste at SMTA International 2012
Sep 12, 2012 | Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Nihon Superior Centre for Manufacture of Electronic Materials at University of Queensland
Aug 01, 2012 | Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).
Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012
Jul 10, 2012 | Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.
Nihon Superior to Debut New Low-Voiding Lead-Free Solder Paste
Jun 25, 2012 | Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
Implementing Lead-Free Soldering with Cost Reduction AND Reliability
May 30, 2012 | Nihon Superior to Offer Voiding Reduction and Aluminum Soldering at Jisso Protec 2012
Nihon Superior President to Participate in NEPCON China Reflow Optimization Roundtable
Apr 21, 2012 | Nihon Superior, a supplier of advanced soldering materials to the global market is proud to announce that its President Tetsuro Nishimura has been invited to participate in a Roundtable discussion, “Optimizing Reflow of Lead-Free Boards and BGAs,” hosted by EMSNow.
Nihon Superior Commemorates Long-Term Partnerships with Balver Zinn and DKL Metals
Apr 05, 2012 | Nihon Superior, a supplier of advanced soldering materials to the global market, recently celebrated milestone anniversaries in its partnerships with Balver Zinn Josef Jost GmbH & Co. KG and DKL Metals Ltd.
Nihon Superior Shanghai to Exhibit at NEPCON China 2012 Implementing Lead-Free Soldering with Cost Reduction and Reliability
Mar 28, 2012 | Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Nihon Superior Issues Reassurance of Product Radiation Levels Since the Japanese Earthquake
Mar 27, 2012 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it is able to report measurements of radiation levels to provide reassurance that products shipped from its distribution center in Toyanaka City, Osaka do not present any risk to its customers.
The Newest Addition to Nihon Superior's SN100C Lead-Free Solder Series Wins a 2012 NPI Award
Mar 05, 2012 | Nihon Superior has received a 2012 NPI Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire.
Nihon Superior to Introduce New Soldering Developments at the 2012 IPC APEX Expo
Feb 22, 2012 | Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
Nihon Superior's Keith Sweatman to Present at TMS Annual Conference
Feb 15, 2012 | Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.
Nihon Superior's Mr. Keith Sweatman to Present at the 2012 IPC APEX EXPO Technical Conference
Feb 07, 2012 | Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Nihon Superior to Exhibit at Electronics For You Expo 2012 (EFYEXPO2012)
Jan 24, 2012 | Nihon Superior (Singapore) Pte. Ltd. will showcase a new, expanded range of SN100C products in booth B-74B at the upcoming Electronics For You Expo 2012 , scheduled to take place February 16-18, 2012 in Hall No. 11 B, at the Pragati Maidan in New Delhi, India.
Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo
Jan 21, 2012 | Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
Nihon Superior’s President Tetsuro Nishimura to Present at SMTA Pan Pacific Microelectronics Symposium 2012
Jan 13, 2012 | Nihon Superior announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.
Nihon Superior to Discuss Intermetallic Stability at the Pan Pacific Microelectronics Symposium
Jan 13, 2012 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium.
Reliability of Lead-Free Solder Joints in Thermal Cycling
Dec 30, 2011 | Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders
Dec 30, 2011 | Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Nihon Superior to Exhibit at Internepcon Japan 2012
Dec 14, 2011 | Nihon Superior will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder in booth East 30-13 at the upcoming Internepcon Japan exhibition. SN100C now has a track record of more than 12 years of successful delivery of high productivity and high reliability.
Nihon Superior Wins Its Fifth Global Technology Award
Nov 20, 2011 | Nihon Superior has received a Global Technology Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire.
University of Queensland Delegation Visits Nihon Superior Co. Ltd.
Nov 08, 2011 | Nihon Superior was honored to receive a visit by a delegation from the University of Queensland
Excellent Drainage Properties of SN100C Confirmed in “Icicle” Test
Nov 08, 2011 | Nihon Superior is proposing that its “Icicle Test” is one of the criteria electronics manufacturers should consider using as they struggle to find a basis for choosing between the various lead-free solders being offered for wave soldering.
Study Conducted by Nihon Superior Demonstrates Value of Collaborative Research with University of Queensland
Nov 03, 2011 | Nihon Superior announces that the research it is funding at the University of Queensland has been cited as a demonstration of the value of such collaboration.
Nihon Superior's SN100C Plays a Part in the WORLD SOLAR CHALLENGE
Oct 21, 2011 | Nihon Superior announces that its unique SN100C® lead-free solder has been used to assemble the controller of 17 of the solar cars participating in the World Solar Challenge
Nihon Superior to Present at SMTA International 2011
Oct 16, 2011 | Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.
Nihon Superior Debuts Selector Guide for SN100C Solder Pastes
Sep 28, 2011 | Nihon Superior introduces the new Selector Guide for SN100C solder pastes.
Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011
Sep 21, 2011 | Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Nihon Superior Introduces Selector Guide for SN100C Flux-Cored Solder Wire
Sep 12, 2011 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the new Selector Guide for SN100C Flux-Cored Solder Wire.
Nihon Superior Thailand Celebrates 10th Anniversary
Sep 07, 2011 | Nihon Superior (Thailand) Co., Ltd., a subsidiary of Nihon Superior Co. Ltd., completed 10 years of successful service in October 2010. The major milestone was celebrated in an event held in the Dusit Thani Hotel in Bangkok on August 6, 2011.
Nihon Superior to Exhibit at Productronica India 2011
Sep 01, 2011 | Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition
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Nihon Superior Introduces SN100C (551CT)
Aug 18, 2011 | Nihon Superior introduces SN100C (551CT), the newest addition to its SN100C lead-free solder series.
Nihon Superior Wins Suita Industry Award
May 19, 2011 | Nihon Superior Co. recently was honored with a 2011 Suita Industry Award. The award was presented to the company during a ceremony on May 7, 2011at the main theater in the Suita Cultural Hall as part of the 28th Suita Industrial fair.
Nihon Superior to Address Key Industry Trends, Concerns at the SMTA Ohio Valley Chapter Meeting
May 16, 2011 | Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.
Nihon Superior’s SN100C (044) Recognized with a Prestigious 2011 EM Asia Innovation Award
May 16, 2011 | Nihon Superior announces that it has been awarded a 2011 NPI Award in the category of Soldering Equipment for its SN100C (044) Flux-Cored Solder Wire.
Nihon Superior's SN100C (044) Honored with a 2011 NPI Award
Apr 20, 2011 | Nihon Superior Co. Ltd. has been awarded a 2011 NPI Award in the category of Cored Wire for its SN100C (044) Flux-Cored Solder Wire.
Nihon Superior’s NS-F900 Flux Wins Its Second Industry Award
Apr 20, 2011 | Nihon Superior Co. Ltd. announces that it has been awarded a 2011 NPI Award in the category of Flux for its NS-F900 Halogen-free Flux for Wave Soldering. The award was presented to the company during a Tuesday, April 12, 2011 ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas during IPC APEX 2011.
Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011
Apr 07, 2011 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell, Technical Director, will present a paper titled "Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly" at the upcoming International Conference on Soldering & Reliability (ICSR).
Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011
Mar 14, 2011 | Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Nihon Superior’s Keith Sweatman to Present at TMS 2011
Mar 01, 2011 | Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
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