Mar 07, 2013 
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will showcase its new DYNAMO™ solder reflow oven in booth #D60 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
The new DYNAMO is specifically targeted for solder reflow of portable electronics. DYNAMO’s simplified configuration delivers 24/7, with proven process repeatability. With 8, 10 and 12 zone air or nitrogen models available, DYNAMO represents BTU quality and reliability. Backed by BTU’s unparalleled worldwide service and applications team, DYNAMO is a value-driven workhorse.
For more information, visit company representatives in booth #D60 or visit us on the Web at www.btu.com.
BTU International is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
