The 2018 Technical Conference Proceedings from the SMTA International Conference and Exhibition (SMTAI) and International Wafer-Level Packaging Conference (IWLPC) are now available for download from the SMTA Knowledge Base.
“This is your source for the latest and highest quality information and research on electronics manufacturing and advanced packaging,” stated Ryan Flaherty, SMTA Director of Communications, in making the announcement. “You can download more than 100 papers that were presented in the technical sessions last fall at SMTA International, and over 30 papers from IWLPC.”
All proceedings can be browsed directly in the online Knowledge Base here.
Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.
The SMTA International Conference and Exhibition (SMTAI) 2019 will be held September 22-26, 2019 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
The next International Wafer-Level Packaging Conference will be held on October 22-24, 2019 at the DoubleTree by Hilton San Jose in San Jose, CA, USA.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.