Jun 09, 2003 International, with the Assembly Tech Expo (ATExpo) show this fall at the
Donald Stephens Convention Center in Rosemont, Illinois (Conference:
September 21-25 Exhibits: September 23-25). The Opening Session and Annual
Meeting during SMTA International will be held on Tuesday, September 23.
The Opening Session, which is free to all attendees, will be from 8:30am to
10:00am and feature Status of the Technology, a comprehensive overview of
component, substrate and assembly issues facing the electronics industry
today. The focus this year will be on Component Trends - A Review of IPC
7095 BGA Implementation; Substrate Trends and Issues - Surface Finish
Comparison; Assembly Trends and Issues - Low Volume Assembly; and Solder
Trends and Issues - Lead Free Soldering. Presentations will be given by
Ray Prasad, Ray Prasad Consultancy; Rob Rowland, RadiSys Corporation; and
Dr. Paul Vianco, Sandia National Labs.
Also during the SMTAI Opening Session, the 2002 Conference Award Winners
will be recognized, including Best of Conference Presentation, Ian Fleck
and Prashant Chouta, Cookson Electronics; Best Proceedings Paper, Fay Hua,
Intel Corporation; and Best International Paper, Robert Kao, Ph.D.,
National Central University-Taiwan.
http://www.smta.org/smtai/special_events.cfm#os
The Annual Meeting from 12:00pm to 1:30pm will feature Brian E. Swiggett,
co-founder and managing partner of Prismark Partners. The title of his
presentation is Prospering in a Reshaped Electronics Industry, which will
provide an overview of fundamental paradigm shifts in the electronics
manufacturing and assembly industry.
As the brutal economic environment of the electronics industry over the
past several years has some believing the industry has reached its
pinnacle, and that the pace of technological progress is grinding to an
interminably slow crawl, the reality is that the future course of
technology will likely depart from the past. The reshaped regional and
structural landscape of the electronics industry certainly continues to
present challenges, but emerging technologies will open up a new world of
materials, processes, and equipment to present the industry infrastructure
with a whole new set of technical and business opportunities.
Brian Swiggett holds B.A. and B.E. degrees from Dartmouth College and its
Thayer School of Engineering and has had a wide range of experience in the
electronics industry over the past twenty years. While at Kollmorgen
Corporation, his responsibilities ranged from systems development to
manufacturing engineering, product marketing and operations in the areas of
electro-mechanical and electro-optic systems, printed circuit manufacturing
and process development, elastomeric connectors, and materials
development. He holds several US patents for his work in these areas.
Also during the Annual Meeting, the SMTA will present its Association
Awards and the Charles Hutchins Educational Grant. The SMTA Awards are
presented annually to members who have given their time, energy, and
expertise to ensure the success of both the SMTA and the industry. The
Hutchins Grant, in memory of industry colleague Charles Hutchins, is a
$5000 award that is given annually to a graduate-level student pursuing a
degree and working on thesis research in electronics packaging or related
field.
The cost for the SMTA Annual Meeting is $30 for SMTA members and $35 for
non-members.
http://www.smta.org/smtai/special_events.cfm#am
Featuring SMT, Flip Chip, MEMS, Chip Scale, BGA, Automotive, Lead-free,
Process Control and more, SMTA International is dedicated to surface mount,
advanced packaging, and related technologies. For full details on SMTA
International and for event registration, visit the on-line conference
brochure at smta.org/smtai or contact SMTA executive administrator JoAnn
Stromberg: 952-920-7682 or joann@smta.org.
http://www.smta.org/smtai/index.cfm
The SMTA membership is a network of professionals who build skills, share
practical experience and develop solutions in electronic assembly
technologies and related business operations.
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