Jan 23, 2009 You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies. Papers are sought in the following key technology tracks:
Assembly
- Adhesives
- BGA/CSP assembly
- Cleaning process
- Connector Technology
- Design for Excellence
- Design for Six Sigma
- Dispensing process
- Equipment selection
- Facility layout
- Flux and solder
- Land pattern design
- Lead-free case studies
- Lead-free soldering
- Lean manufacturing
- Low volume / prototype assembly
- Medical electronics
- Placement process
- Printing process
- Solder paste
- Reflow soldering
- Rework and repair of QFNs
- RFID Assembly
- Selective soldering
- Set up reduction
- Supplier engineering (board assembly)
- Vapor phase reflow for high reliability assemblies
- Wave soldering
- Yield Improvement
Business
- Capacity modeling
- Contract manufacturing
- Design for Success - Remaining Competitive
- Doing business in China
- Environmental issues
- Lean Manufacturing
- Operations management
- RoHS Compliance
- Supplier management
- Technology roadmaps
- Total quality management
Components
- Ball grid arrays
- Battery interaction
- Chip scale packages, including WL-CSP
- Component reliability
- Component solderability
- Connectors
- Direct chip attach (flip chip)
- Embedded passives
- Failure analysis
- Fine pitch technology
- Harsh environments (automotive, military, space)
- Lead/termination finish
- Leadless packaging
- MultiChip packages, including 3D packaging
- Tin Whiskers
Emerging Technologies
- 0201/01005 Components and Assembly
- Consumer Applications
- Electronic Printing Technology
- Embedded Technology / Actives and Assembly
- "Getters"
- MEMS/RF, MEMS/MOEMS
- Nanoelectronics, Reliability of Nanodevices
- New Materials and Processes
- Optoelectronics
- Power or Thermal Management
- Sensors and Manufacturing
- Solar Technology
- System in a Package
- Thermal Interface Materials
- Wireless Applications including Bluetooth and Wi-Fi
PCB Technology
- Black pad and surface finish defects
- Embedded passive components (capacitors, resistors, inductors)
- Halogen Free
- HDI
- Microvias, filled and unfilled
- Moisture sensitivity
- Soldermask
- Substrate reliability
- Substrate solderability
- Surface finish
Process Control
- Acoustic imaging
- AOI
- Computer integrated manufacturing
- In-circuit test
- Process modeling
- Software
- Test strategies
- X-ray
SMTA International offers three awards, each worth $1000USD and a recognition plaque: "Best of Conference Presentation", "Best of Proceedings Paper", and "Best International Paper". Additionally, speakers make a contribution to our industry by sharing their research and findings, and they help to advance the industry and are recognized by their colleagues.
Abstracts (300 words) are due March 27, 2009. Proposals are also solicited from individuals interested in teaching educational courses related to surface mount technology, advanced packaging, and electronics manufacturing. Course length may be half-day or full-day, and these proposals must also be submitted by March 27, 2009.
Paper manuscripts and course workbooks are due by July 6, 2009. Papers should be 6-15 pages long (including graphics) and describe significant results from experiments, emphasize new techniques, or contain technical, economic, or appropriate test data. Presentation materials and papers must be original, unpublished, and non-commercial in nature.
Visit smta.org/smtai/call_for_papers.cfm for complete details on SMTA International and to submit your abstract for the 2009 program.
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