Mar 26, 2010 
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as Quad Flat Pack – No Lead (QFP) (also referred to as Leadless Plastic Packages), increased use of chip scale packages as well as increased component density and tighter PCB layouts. Advanced package innovations and new flux types may compromise the validity of the R.O.S.E. cleanliness testing method.
The presentation will discuss the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies. It also will present the quality assurance and process control improvements needed to clean, extract and measure the resistivity of solvent extract on today’s circuit assemblies.
For more information, or to view the schedule of events, visit http://www.goipcshows.org.
Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant. For more information, visit http://www.kyzen.com.
