Nov 03, 2010 
Cleaning challenges have increased with the growing complexity of electronics assemblies: miniaturization, alloys, board finishes, lower component gaps and improved flux designs. The need to remove ionizable contaminants is critical to production yields and reliability.
The workshop will provide considerations for integrating the cleaning agent and equipment — for maximum performance and minimum variation in the manufacturing process such as:
- Lead-free/miniaturization cleaning influences
- Understanding soil properties
- Matching the cleaning agent to the soil and process
- Materials compatibility issues
- Evaluating parameters ― pressure, flow temperature and throughput equipment
- Implementing process controls
- Successful system integration
Co-founder and CTO of Kyzen, Dr. Mike Bixenman has more than 35 years of experience in wet chemistries. He is an active researcher and, working with his research team, customers and industry partners, has helped develop environmental conscious cleaning processes that meet the demanding needs of today’s electronic assembly manufacturing.
Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant. For more information, visit http://www.kyzen.com
