Oct 05, 2015 Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Indium Corporation experts will be presenting five papers at the event:
- High-Reliability, No-Clean Solder Paste for Designs Where Flux Cannot be Dried by Dr. Ning-Cheng Lee, Vice President of Technology, and Fen Chen, Bench Chemist;
- Porosity Evolution of Ag-Sintering at Die-Attach by Dr. Ning-Cheng Lee;
- Types of Solder Preforms and Difficult Geometries by Herbert Ludoweig, Product Specialist for Engineered Solders;
- The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process by Brandon Judd, Technical Support Engineer, Southwest/Rocky Mountains, U.S.;
- Optimal SMT Electronics Assembly Guidelines for Stencil Printing by Ed Briggs, Senior Technical Support Engineer
Indium Corporation experts will also serve as chairs for the following sessions:
- 3D Solutions for Specific Applications with Maria Durham, Technical Support Engineer, Semiconductor and Advanced Assembly Materials;
- Materials and Processes with Tim Jensen, Senior Product Manager for Engineered Solders
Jensen will also lead a professional development course titled Improving Mechanical, Electrical, and Thermal Reliability of Electronics. This course is designed to provide practical knowledge that can be applied to current processes to improve the overall reliability of the electronics assemblies.
IMAPS is the largest technical society dedicated to the advancement and growth of microelectronics and electronics packaging. Their 48th Symposium on Microelectronics will cover three tiers of electronics: systems and applications; design and related measurements; and materials, process, and reliability. Indium Corporation will be exhibiting at booth 517. For more information, visit www.imaps2015.org.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
