Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, December 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
As the industry continues to embrace electrification, especially in automotive power modules and RF communication, a number of design challenges are emerging that impact the critical reliability performance for the final product. Uniform bondlinethicknesswithin assembly solder joints has a direct link to reliability, as an uneven bondline can result in early cracking and solder layer delamination. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Hertline will examine how InFORMS®, a reinforced matrix solder composite preform and ribbon (patent pending), delivers uniform bondline control with superior mechanical strength, enhancing reliability by a factor of 2X while achieving the lowest cost of ownership.
To register for the webinar, visit https://imaps.org/technical_webinarseries_9dece.php.
Hertline is the Product Manager for Engineered Solder Materials focusing on Power Electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market.Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry. Most recently, he was focused on developing and supporting tactical radio communications products.
If you’re looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar at www.indium.com/webinar.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.