Apr 29, 2021 
Indium Corporation’s Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May 12-14.
The factors that are driving the wider electronics industry towards lower process temperatures are also having an impact on the firstlevel interconnects that are the interface between the increasingly complex processors and the circuitry that relies on those processors for delivering the functionality on which modern society is now so dependent. In Low-Temperature First Level Interconnect in Packaging and its Challenges, Lim examines materials and processes currently used for firstlevel interconnects and possible options for achieving significant reductions in temperatures to which the processor is exposed during packaging.
Lim is the Global Product Manager for Semiconductor and Advanced Materials and is based in Malaysia. She manages the semiconductor product lines globally and works closely with the internal sales and R&D teams to develop solutions for industry needs and requirements. She also collaborates with external customers and corporate partners to support the industry’s move towards heterogeneous integration. Some of her recent work includes the development of materials and processes for advanced packaging for fine feature printing for SiP applications as well as for one-step OSP ball-attach applications. Lim has more than 25 years of experience, specifically in the areas of PCB assembly and surface mount technology. She joined Indium Corporation in 2007 as a technical manager in Southeast Asia. Prior to that, she was a research and development chemist, focusing on solder paste and flux formulation. Lim also worked as a technical manager at Inventec for nine years, where she provided technical support and managed testing in the lab. Lim earned her bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus in polymers. She is a Certified SMT Process Engineer, has earned her Six Sigma Green Belt designation, and is heavily involved in many research and road mapping organizations.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/or @IndiumCorp.
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrateexhibitors’ technologies and products as well as expand their customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless andcomponents, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.
