Apr 07, 2011 
Practical Components will supply the new Amkor TMV PoP (Package on Package) dummy component to the Future Proof Assembly Line. The Amkor TMV® technology provides several key benefits:
- Enables scaling of the PoP stacked interface to 0.4 mm pitch in support of emerging high-density memory architectures
- Allows for larger silicon area within an existing package footprint, benefiting both system architects and IC designers
- Supports flip chip, wirebond, stacked die and passive integration within the bottom package for increased integration and design flexibility
- Provides reduced package warpage, enabling thinner PoP stacks and improved surface mount assembly for high-density, fine-pitch applications.
The Practical Dummy Component® version of the TMV® is identical to the live package without the expensive die inside. These are made of the same materials on the same manufacturing lines and have the same size, thermal and soldering properties as the live equivalent.
National Electronics Week’s live production line will feature an amalgamation of companies coming together to show cutting edge technologies and capabilities over the two days of the exhibition. Visit stand N401 to see this process and follow it step by step with an introduction to all the machines and consumables used along the line ― and when the process is complete visitors can take the PCBs as a memento.
Since 1996, Practical Components (http://www.practicalcomponents.com) has been the world’s leading supplier of dummy components, which are the exact mechanical equivalents of live components, used when only the physical properties of the components are required. These components can cost as much as 80% less than live components, making them ideal for testing of solder processes, machine setup and other process evaluations. Practical Components is headquartered in Los Alamitos CA and has a worldwide distribution network.
