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Microsemi Introduces 600 Volt Silicon Carbide Schottky Diodes in Powermite Packages

Sep 27, 2001

Microsemi Corp. (Nasdaq:MSCC), today announced that as a result of its alliance with Cree Inc. (Nasdaq:CREE), Microsemi has produced the first in a series of commercial silicon carbide (SiC) Schottky diodes featuring Microsemi's patented Powermite(R) surface mount packages.

Designated the UPSC200, 400, 600(TM) and UPSC203, 403, 603(TM) Series, the new SiC Schottky diodes are rated at 1Amp-600 volts and 4Amp-600 volts. The UPSC200, 400, 600 features a maximum current rating of 1Amp, a forward voltage drop of 1.6 Volts typical and a reverse leakage of 20uA typical. The UPSC4600 features a maximum current rating of 4Amps, forward voltage drop of 1.7 Volts typical and a reverse leakage of 20uA typical.

The UPSC200, 400, 600 are packaged in the two-lead Powermite package having a 2.54mm x 2.67mm footprint while the UPSC4600 is packaged in Microsemi's three-lead Powermite 3(R) package, with a 4.82mm x 5.33mm footprint. These two products offer the highest power and voltage combination available in packages this small. Conventional silicon-based devices are four times the size.

Typically Schottky diodes are used for their high efficiency in low voltage (5-40 Volt) power applications where their "near zero" switching speed makes them the most cost-effective solution. In high voltage applications (greater than 100 Volts), designers switch to ultra fast rectifiers which have a higher resistance and slower switching speed. Microsemi's new SiC high voltage line of Schottkys provides a combination of efficiency and high voltage so circuit designers can achieve performance metrics never previously possible.

"These new silicon carbide devices are powerful additions to our line of surface mount Schottky diodes," said Manuel Lynch, vice president of business development. "We expect their combination of efficiency and high voltage to be particularly valuable in cardioverter defibrillator applications, military aircraft and high voltage telecommunication switching equipment," he said.

Microsemi's alliance with Cree joins Cree's expertise in silicon carbide technology with Microsemi's packaging and application marketing strengths. The two companies announced the formation of the SiC Schottky diode alliance in May 2001.

In commenting on the product introduction, Cree president and CEO Charles Swoboda stated, "We believe that with Cree's silicon carbide Schottky diode 'inside' the Powermite package, Microsemi has an exciting and new enabling technology for their power semiconductor product line."

Both devices are available for immediate sampling and volume shipment. The UPSC200, 400, 600 series is priced at $15 in 1,000-piece quantities and the UPSC203, 403, 603 at $25 in 1,000-piece quantities.

Complete technical information and data sheets are available on the Microsemi Web site, http://www.microsemi.com.

About Microsemi

Microsemi is a leading designer, manufacturer and marketer of analog, mixed-signal and discrete semiconductors. The company's semiconductors manage and regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi products include individual components as well as complete circuit solutions that enhance customer designs by providing battery optimization, reducing size or protecting circuits. Markets the company serves include mobile connectivity, computer/peripherals, telecommunications, medical, industrial/commercial, space/satellite and military.

More information may be obtained by contacting the company directly or by visiting its Web site at http://www.microsemi.com.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding the making of estimates and projections, hiring and retention of qualified technical personnel in a competitive labor market, acquiring and integrating new operations or assets, rapidly changing technology and product obsolescence, the ability to realize cost savings or productivity gains, the ability to improve capacity utilization, potential cost increases, the strength and competitive pricing environment of the marketplace, demand for and acceptance of the company's products, the results of planned development, marketing and promotional campaigns, changes in demand for products, difficulties of foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, business and economic conditions or adverse changes in current or expected industry conditions, customer order preferences, and fluctuations in market prices of the company's common stock, difficulties in implementing company strategies, environmental matters, litigation, difficulties protecting proprietary rights, and inventory obsolescence. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties and risks identified in the company's most recent Form 10-K filed on Dec. 21, 2000, and the final prospectus on Form S-3 filed on June 1, 2000, by the company with the Securities and Exchange Commission. The company does not undertake to supplement or correct any information in this release that is or becomes incorrect

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