SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

May 04, 2012

 As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding. Printed boards that incorporate high speed chips and microwave circuitry have many parameters that are quite different from more mainstream rigid and flexible printed boards. These differences are covered in the “B” revision of IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards, and the changes to the specification are extensive.


According to Michael Luke, chair of the IPC-D22 High Speed/High Frequency Board Performance Subcommittee that developed IPC-6018B, microwave boards are often made with polytetrafluoroethylene (PTFE) materials. These laminates have distinctive properties when layered together. For example, drilling microwave boards made with PTFE can often leave behind resin debris or “resin smear.” This is a big issue that Luke says is addressed in the revised document by providing specific criteria for the allowance of resin smear.


In addition, references to embedded passive resistors and capacitors have been included within the specification. “This version also better defines hole breakout requirements that occur when holes aren’t drilled in the center of a pad,” Luke adds. “Thermal stress” criteria have also been revised to address advances in the convection reflow process for thermal stressing of microsections or production printed board samples. “Now we have three techniques for subjecting product to thermal stress for evaluation and acceptance. In the past, there was only one. We’ve also added two new reflow profiles,” explains Luke.


The specification also expands the types of finishes that can be used. Electroless nickel/electroless palladium/immersion gold (ENEPIG), immersion silver and immersion tin are just a few examples.


The B revision includes new requirements for procurement selection, copper wrap/cap plating of filled holes, laminate cracks and voids and etchback. In addition, at the end of the document, a table for inspection criterion has been updated and an appendix for the space and avionics industries which have tighter requirements has been added.
IPC-6018B is available for purchase by IPC members for $46. The standard industry price is $93. For more information or to purchase a copy of IPC-6018B, visit www.ipc.org/6018.


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Sep 16, 2024 -

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

Sep 09, 2024 -

Calling All California Employers: Harness State Funding for Workforce Training with IPC and ETP

Sep 09, 2024 -

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025

Sep 02, 2024 -

IPC's Road to Reliability Webinar Series Covers New e-Mobility Technologies

Sep 02, 2024 -

North American PCB Industry Sales Down 21.2 Percent in July

Aug 26, 2024 -

North American EMS Industry Up 1.9 Percent in July

Aug 26, 2024 -

IPC Partners with Stephen F. Austin State University's CARRI and the IPC Education Foundation for Workforce Development in Electronics Manufacturing

Aug 19, 2024 -

Electronics Industry Sentiment Rebounds in August After Three-Month Decline

Aug 19, 2024 -

Latest Advancements in High-Reliability Electronics Focus of 2024 IPC High Reliability Forum

Aug 07, 2024 -

Diana Radovan Joins IPC as New Sustainability Policy Director

1512 more news from Association Connecting Electronics Industries (IPC) »

Sep 20, 2024 -

VIBRO METER VM600 MPC4 200-510-070-113

Sep 20, 2024 -

Triconex CM3201 Digital input unit control card Module

Sep 20, 2024 -

WOODWARD 9907-186 Load Sharing Module

Sep 20, 2024 -

Triconex 3603T Digital Output

Sep 20, 2024 -

BENTLY NEVAD 330101-00-16-10-02-00

Sep 20, 2024 -

EPRO PR9268/201-000

Sep 20, 2024 -

ABB SPDSI13 Analog input module

Sep 20, 2024 -

HONEYWELL MU-TSIM12 51303932-426

Sep 20, 2024 -

Schneider 140CRA21220

Sep 20, 2024 -

PFEIFFER D-35614

See electronics manufacturing industry news »

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology news release has been viewed 1130 times

  • SMTnet
  • »
  • Industry News
  • »
  • Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology
Find Replacement SMT Nozzles and Feeders

Win Source Online Electronic parts